Chip structure with redistribution traces

• US 7,425,767 B2
• Filed: 09/26/2007
• Issued: 09/16/2008
• Est. Priority Date: 07/14/2004
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Megica Corporation (Chipbond Technology Corporation)
• Inventors: Lin, Mou-Shiung
• Primary Examiner(s): Pert; Evan
• Assistant Examiner(s): MANDALA, VICTOR A
• Application Number:
  US11/861,290
• Publication Number:
  US 20080012132A1
• Time in Patent Office: 356 Days
• Field of Search: 257/784, 257/781, 257/786, 257/E23.02
• US Class Current: 257/781
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05157 Cobalt [Co] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05181 Tantalum [Ta] as principal constituent
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05669 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/05673 Rhodium [Rh] as principal constituent
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45164 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/45173 : Rhodium (Rh) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48839 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48844 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48847 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48869 : Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48873 : Rhodium (Rh) as principal constituent
• CPC Class Codes: H01L 2224/49171 : Fan-out arrangements
• CPC Class Codes: H01L 23/525 : with adaptable interconnections
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01201 : 1N purity grades, i.e. 90%
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A semiconductor chip or wafer comprises a passivation layer and a circuit line. The passivation layer comprises an inorganic layer. The circuit line is over and in touch with the inorganic layer of the passivation layer, wherein the circuit line comprises a first contact point connected to only one second contact point exposed by an opening in the passivation layer, and the positions of the first contact point and the only one second contact point from a top view are different, and the first contact point is used to be wirebonded thereto.

Claims

1. A semiconductor chip assembly comprising:

a chip comprising a semiconductor substrate, a MOS device in or on said semiconductor substrate, a metallization structure over said semiconductor substrate, a passivation layer over said metallization structure, wherein said passivation layer comprises a nitride layer, and wherein a first opening in said passivation layer is over an original IC connection point of said metallization structure and exposes said original IC connection point, a metal trace over said passivation layer and over said original IC connection point, wherein said metal trace is connected to said original IC connection point through said first opening, and a redistributed pad connected to said original IC connection point through said metal trace, wherein said metal trace does not connect said original IC connection point to any other metal portion under said passivation layer, wherein said redistributed pad has a position from a top view different from that of said original IC connection point, wherein said redistributed pad is entirely over said passivation layer, and no opening in said passivation layer is under said redistributed pad, wherein said redistributed pad comprises an adhesion/barrier layer, a first gold layer over said adhesion/barrier layer, and a second gold layer over said first gold layer, wherein said second gold layer contains gold with greater than 90 weight percent and has a thickness between 2 and 30 micrometers, and wherein said chip has a first edge and a second edge neighboring to said first edge, wherein the minimum distance between said first edge and said original IC connection point is smaller than that between said second edge and said original IC connection point, and the minimum distance between said first edge and said redistributed pad is greater than that between said second edge and said redistributed pad; and

a wire wirebonded to said redistributed pad, wherein said wire is across said second edge.

2. The semiconductor chip assembly of claim 1, wherein said adhesion/barrier layer comprises titanium.

3. The semiconductor chip assembly of claim 1, wherein said MOS device is under said redistributed pad.

4. The semiconductor chip assembly of claim 1 further comprising a circuit board and multiple solder balls under said circuit board, wherein said chip is over said circuit board and said wire connects said redistributed pad to said circuit board.

5. The semiconductor chip assembly of claim 1, wherein said chip further comprises a polymer layer over said passivation layer and on said metal trace, wherein a second opening in said polymer layer is over said redistributed pad and exposes said redistributed pad.

6. The semiconductor chip assembly of claim 5, wherein said polymer layer has a thickness between 2 and 15 micrometers.

7. The semiconductor chip assembly of claim 1, wherein said nitride layer has a thickness between 0.2 and 1.2 micrometers.

8. A chip package comprising.

a chip comprising a semiconductor substrate, a MOS device in or on said semiconductor substrate, a metallization structure over said semiconductor substrate, a passivation layer over said metallization structure, wherein said passivation layer comprises a nitride layer, and wherein a first opening in said passivation layer is over a first original IC connection point of said metallization structure and exposes said first original IC connection point, and a second opening in said passivation layer is over a second original IC connection point of said metallization structure and exposes said second original IC connection point, a metal trace over said passivation layer, wherein said metal trace is connected to said first original IC connection point through said first opening, a redistributed pad connected to said first and second original IC connection points through said first and second openings, wherein said redistributed pad is connected to said first original IC connection point through said metal trace, wherein said redistributed pad has a position from a top view different from those of said first and second original IC connection points, wherein said redistributed pad is entirely over said passivation layer, and no opening in said passivation layer is under said redistributed pad, and wherein said redistributed pad comprises a titanium-containing layer, a first gold layer over said titanium-containing layer, and a second gold layer over said first gold layer, wherein said second gold layer contains gold with greater than 90 weight percent and has a thickness between 2 and 30 micrometers, and a polymer layer over said passivation layer and on said metal trace, wherein a third opening in said polymer layer is over said redistributed pad and exposes said redistributed pad;

and

a wire wirebonded to said redistributed pad, wherein said wire is across an edge of said chip.

9. The chip package of claim 8, wherein said MOS device is under said redistributed pad.

10. The chip package of claim 8 further comprising a circuit board and multiple solder balls under said circuit board, wherein said chip is over said circuit board and said wire connects said redistributed pad to said circuit board.

11. The chip package of claim 8, wherein said polymer layer comprises polyimide.

12. The chip package of claim 8, wherein said polymer layer has a thickness between 2 and 15 micrometers.

13. The chip package of claim 8, wherein said nitride layer has a thickness between 0.2 and 1.2 micrometers.

14. A semiconductor chip assembly comprising:

a chip comprising a semiconductor substrate, a MOS device in or on said semiconductor substrate, a metallization structure over said semiconductor substrate, a passivation layer over said metallization structure, wherein said passivation layer comprises a nitride layer, and wherein a first opening in said passivation layer is over an original IC connection point of said metallization structure and exposes said original IC connection point, a first redistributed pad connected to said original IC connection point through said first opening, wherein said first redistributed pad has a position from a top view different from that of said original IC connection point, wherein said first redistributed pad is entirely over said passivation layer, and no opening in said passivation layer is under said first redistributed pad, and wherein said first redistributed pad comprises an adhesion/barrier layer, a first gold layer over said adhesion/barrier layer, and a second gold layer over said first gold layer, wherein said second gold layer contains gold with greater than 90 weight percent and has a thickness between 2 and 30 micrometers, and a second redistributed pad connected to said original IC connection point through said first opening, wherein said second redistributed pad has a position from a top view different from that of said original IC connection point, and wherein said second redistributed pad is entirely over said passivation layer, and no opening in said passivation layer is under said second redistributed pad; and

a wire wirebonded to said first redistributed pad, wherein said wire is across an edge of said chip.

15. The semiconductor chip assembly of claim 14, wherein said adhesion/barrier layer comprises titanium.

16. The semiconductor chip assembly of claim 14, wherein said MOS device is under said first redistributed pad.

17. The semiconductor chip assembly of claim 14 further comprising a circuit board and multiple solder balls under said circuit board, wherein said chip is over said circuit board and said wire connects said first redistributed pad to said circuit board.

18. The semiconductor chip assembly of claim 14, wherein said chip further comprises a polymer layer over said passivation layer, wherein a second opening in said polymer layer is over said first redistributed pad and exposes said first redistributed pad.

19. The semiconductor chip assembly of claim 18, wherein said polymer layer has a thickness between 2 and 15 micrometers.

20. The semiconductor chip assembly of claim 14, wherein said nitride layer has a thickness between 0.2 and 1.2 micrometers.