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System and method of fabricating micro cavities

  • US 7,429,495 B2
  • Filed: 11/13/2003
  • Issued: 09/30/2008
  • Est. Priority Date: 08/07/2002
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing a plurality of micro enclosures on a substrate wafer, comprising steps of:

  • (1) bonding a cap wafer to said substrate wafer with an adhesive layer to form the top and the bottom of said micro enclosures;

    (2) patterning and etching said cap wafer and said adhesive layer to form islands of layers of said cap wafer and said adhesive layer on said substrate wafer; and

    (3) depositing and patterning at least one metal layer to cover the outer sidewall surfaces around said islands, including the sidewall surfaces of said cap wafer and said adhesive layer, to form sidewall of said enclosures.

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