System and method of fabricating micro cavities
First Claim
1. A method of manufacturing a plurality of micro enclosures on a substrate wafer, comprising steps of:
- (1) bonding a cap wafer to said substrate wafer with an adhesive layer to form the top and the bottom of said micro enclosures;
(2) patterning and etching said cap wafer and said adhesive layer to form islands of layers of said cap wafer and said adhesive layer on said substrate wafer; and
(3) depositing and patterning at least one metal layer to cover the outer sidewall surfaces around said islands, including the sidewall surfaces of said cap wafer and said adhesive layer, to form sidewall of said enclosures.
0 Assignments
0 Petitions
Accused Products
Abstract
A system and method for manufacturing micro cavities at the wafer level using a unique, innovative MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed, with epoxy bonded single-crystalline silicon membrane as cap and deposited and/or electroplated metal as sidewall, on substrate wafers. The epoxy is also the sacrificial layer. It is removed from within the cavity through small etch access holes etched in the silicon cap before the etch access holes are sealed under vacuum. The micro cavities manufactured therein can be used as pressure sensors or for packaging MEMS devices under vacuum or inert environment. In addition, the silicon membrane manufactured therein can be used to manufacture RF switches.
-
Citations
18 Claims
-
1. A method of manufacturing a plurality of micro enclosures on a substrate wafer, comprising steps of:
-
(1) bonding a cap wafer to said substrate wafer with an adhesive layer to form the top and the bottom of said micro enclosures; (2) patterning and etching said cap wafer and said adhesive layer to form islands of layers of said cap wafer and said adhesive layer on said substrate wafer; and (3) depositing and patterning at least one metal layer to cover the outer sidewall surfaces around said islands, including the sidewall surfaces of said cap wafer and said adhesive layer, to form sidewall of said enclosures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
Specification