Ultramicrotome device

• US 7,430,946 B2
• Filed: 08/01/2006
• Issued: 10/07/2008
• Est. Priority Date: 12/19/1997
• Status: Expired due to Fees

• Current Assignee: Anton Meyer & Co. AG (Meyco Holding AG)
• Original Assignee: Anton Meyer & Co. AG (Meyco Holding AG)
• Inventors: Studer, Daniel
• Primary Examiner(s): Peterson; Kenneth E.
• Application Number:
  US11/497,488
• Publication Number:
  US 20060266177A1
• Time in Patent Office: 798 Days
• Field of Search: 83/42, 837/07, 837/13, 839/155, 839/56
• US Class Current: 83/42
• CPC Class Codes: B26D 7/086 by vibrating, e.g. ultrasonically
• CPC Class Codes: G01N 1/06 providing a thin slice, e.g. microtome
• CPC Class Codes: G01N 1/36 Embedding or analogous mounting of samples
• CPC Class Codes: G01N 2001/063 with sawing action
• CPC Class Codes: Y10T 83/04 Processes
• CPC Class Codes: Y10T 83/0538 Repetitive transverse severing from leading edge of work
• CPC Class Codes: Y10T 83/6508 With means to cause movement of work transversely toward plane of cut
• CPC Class Codes: Y10T 83/97 Miscellaneous

Abstract

In a process for cutting sections from a probe for microscopic analysis, an ultramicrotome device is used having a blade with a cutting edge, the cutting edge extending at least approximately in a first direction. The process includes the steps of: vibrating the blade in the first direction; and moving the blade relative to the probe to be cut in a second direction, the second direction being perpendicular to the first direction. This eliminates, or at least strongly reduces, compression of the cut sections.

Claims

1. A process for cutting sections from a probe for microscopic analysis, by using an ultramicrotome device having a blade with a cutting edge, the cutting edge in a non-vibrated position extending at least approximately in a first direction, the process comprising the steps of:

vibrating the blade in the first direction;

vibrating the probe;

between successive cuts, effecting relative movement between the probe and the blade in a second direction in a stepwise manner, the second direction being perpendicular to the first direction; and

during each cut, effecting relative movement between the probe and the blade in a third direction perpendicular to the first and second directions, whereby the probe is cut in sections

wherein the probe is vibrated approximately parallel to the first direction, and

wherein the probe and blade are vibrated such that when the blade reaches its reversal points, the probe is still moving and vice versa.

2. The process according to claim 1, wherein the probe is cut in sections having a thickness of about 10 to about 100 nm.

3. The process according to claim 1, wherein the blade is vibrated with a maximum amplitude of about 1 μ

m.

4. The process according to claim 1, wherein the ultramicrotome device includes a block holding the blade, wherein the process further comprises the step of applying force to the block.

5. The process according to claim 1, wherein the probe is vibrated in the third direction.

6. The process according to claim 5, wherein the blade is vibrated in a first frequency and the probe is vibrated in a second frequency, the second frequency being about twice the first frequency.

7. The process according to claim 5, wherein the probe is vibrated with an amplitude b_o of vibration with

b_o≧

v_c/2ω

,

wherein ω

is the frequency in radians per second of the vibration of the blade and v_c is the cutting speed in the third direction.

8. The process according to claim 1, wherein the blade is vibrated in the first direction with a frequency above about 15 kHz.

9. The process according to claim 1, wherein the probe and the blade are vibrated at the same frequency, but in a different phase.

10. The process according to claim 1, wherein, during each cut, relative movement between the vibrating probe and the vibrating blade in the third direction is effected with a substantially constant cutting speed over a distance larger than a cross-sectional dimension of the probe in the third direction.

11. The process according to claim 1, wherein during each cut, relative movement between the vibrating probe and the vibrating blade in the third direction is effected with a substantially constant cutting speed.

12. The process according to claim 1, wherein the blade is vibrated with an amplitude a_o of vibration with

a_o≧

10 v_c/ω

,

wherein ω

is the frequency in radians per second of the vibration of the blade and v_c is the cutting speed in the third direction.

13. The process according to claim 1, wherein a diamond blade is used.