Semiconductor device and method of manufacturing the same
First Claim
1. A method of manufacturing a semiconductor device having a transistor controlling a current flowing in a base layer by a gate electrode and a diode, comprising the steps of:
- preparing a semiconductor substrate of a first conductivity type having first and second major surfaces;
forming a first conductivity type semiconductor layer on the first major surface of the semiconductor substrate;
forming a base layer of a second conductivity type on the surface of the semiconductor layer;
forming a pair of groove portions penetrating the base layer from the first major surface and reaching at least the semiconductor layer;
disposing an insulation film inside the groove portion and forming a gate electrode inside the groove portion through the insulation film forming an inter-layer insulation film to cover the top of the groove portion;
forming a first conductivity type semiconductor layer and a second conductivity type semiconductor layer on the second major surface of the semiconductor substrate; and
disposing an emitter region along the groove portions only in a section of the base layer on the first major surface and located between the pair of groove portions.
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Accused Products
Abstract
A semiconductor device, including: a semiconductor substrate of a first conductivity type having a first and second major surfaces; a first conductivity type semiconductor layer formed on the first major surface of the semiconductor substrate; a base layer of a second conductivity type formed on the first major surface of the semiconductor layer and separated by the semiconductor layer from the semiconductor substrate; a pair of groove portions penetrating the base layer from the first major surface and reaching at least the semiconductor layer; an insulation film disposed inside the groove portion and a gate electrode formed inside the groove portion through the insulation film; a first conductivity type semiconductor layer and a second conductivity type semiconductor layer formed on the second major surface of the semiconductor substrate; and an emitter region disposed on the first major surface of the base layer and along the groove portions, wherein a transistor controlling a current flowing in the base layer by the gate electrode and a diode made of the semiconductor layer and the base layer are disposed within the semiconductor device, and the emitter region is disposed only in an area which is between the pair of groove portions.
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Citations
14 Claims
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1. A method of manufacturing a semiconductor device having a transistor controlling a current flowing in a base layer by a gate electrode and a diode, comprising the steps of:
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preparing a semiconductor substrate of a first conductivity type having first and second major surfaces; forming a first conductivity type semiconductor layer on the first major surface of the semiconductor substrate; forming a base layer of a second conductivity type on the surface of the semiconductor layer; forming a pair of groove portions penetrating the base layer from the first major surface and reaching at least the semiconductor layer; disposing an insulation film inside the groove portion and forming a gate electrode inside the groove portion through the insulation film forming an inter-layer insulation film to cover the top of the groove portion; forming a first conductivity type semiconductor layer and a second conductivity type semiconductor layer on the second major surface of the semiconductor substrate; and disposing an emitter region along the groove portions only in a section of the base layer on the first major surface and located between the pair of groove portions. - View Dependent Claims (2)
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3. A semiconductor device, comprising:
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a semiconductor substrate of a first conductivity type having a first and second major surfaces; a first conductivity type semiconductor layer formed on the first major surface of the semiconductor substrate; a base layer of a second conductivity type formed on the first major surface of the semiconductor layer and separated by the semiconductor layer from the semiconductor substrate; a pair of groove portions penetrating the base layer from the first major surface and reaching at least the semiconductor layer; an insulation film disposed inside the groove portion and a gate electrode formed inside the groove portion through the insulation film an inter-layer insulation film formed to cover the top of the groove portion; a first conductivity type semiconductor layer and a second conductivity type semiconductor layer formed on the second major surface of the semiconductor substrate; and an emitter region disposed on the first major surface of the base layer and along the groove portions, wherein a transistor controlling a current flowing in the base layer by the gate electrode and a diode made of the semiconductor layer and the base layer are disposed within the semiconductor device, and the emitter region is disposed only in an area which is between the pair of groove portions. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification