Cleaning substrates having low soil redeposition

• US 7,432,234 B2
• Filed: 07/25/2005
• Issued: 10/07/2008
• Est. Priority Date: 12/16/2003
• Status: Active Grant

• Current Assignee: Clorox Company
• Original Assignee: Clorox Company
• Inventors: Ochomogo, Maria G., Phillippi, Martin A., Budd, David L., De Leo, Malcolm A.
• Primary Examiner(s): Del Cotto; Gregory R
• Application Number:
  US11/188,544
• Publication Number:
  US 20080128003A1
• Time in Patent Office: 1,170 Days
• Field of Search: None
• US Class Current: 510/295
• CPC Class Codes: A47L 13/16 Cloths; Pads; Sponges metal scraping sponges A47L13/07
• CPC Class Codes: C11D 17/049 Cleaning or scouring pads; Wipes
• CPC Class Codes: C11D 3/3703 Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
• CPC Class Codes: C11D 3/3723 Polyamines or polyalkyleneimines

Abstract

Incorporating dirt-attracting polycationic polymers, such as polyethyleneimines, into cleaning wipes, mop pads, and similar substrates, improves dirt pick-up and retards redeposition of the dirt back onto the cleaned surface. The polymers can be incorporated directly into the non-woven substrates or they can be formulated with a cleaning composition for use with the substrate. The substrate containing the dirt-attracting polycationic polymers can be employed to clean hard and soft surfaces. The presence of the dirt-attracting polycationic polymers also facilitates biocide release from the substrates.

Claims

1. A wipe comprising:

a. a subbstrate which comprises a nonwoven material,

b. wherein said substrate is impregnated with a polycationic polymer selected from the group consisting of polyethyleneimine, copolymers of polyethyleneimine and combinations thereof;

wherein said polymer has a molecular weight ranging from about 500,000 to about 2,000,000; and

c. wherein said wipe is dry.

2. The wipe of claim 1, wherein said substrate is a cleaning or antimicrobial wipe.

3. The wipe of claim 2, wherein said substrate is attached to a cleaning implement.

4. The wipe of claim 1, wherein said polymer has a charge density greater than 10 meq/g at pH 4.5.

5. The wipe of claim 1, wherein said polymer comprises 0.01 to 0.5% by weight of said wipe.