Substrate heat treatment apparatus

• US 7,432,476 B2
• Filed: 05/03/2006
• Issued: 10/07/2008
• Est. Priority Date: 05/12/2005
• Status: Active Grant

• Current Assignee: SCREEN Holdings Co., Ltd.
• Original Assignee: SCREEN Holdings Co., Ltd.
• Inventors: Matsuchika, Keiji, Goto, Shigehiro, Morita, Akihiko
• Primary Examiner(s): PAIK, SANG YEOP
• Application Number:
  US11/417,691
• Publication Number:
  US 20060289432A1
• Time in Patent Office: 888 Days
• Field of Search: 2194431-4682, 118/723.VE, 118/724, 118/725, 432/81, 432/253, 392/416, 392/418
• US Class Current: 219/444.1
• CPC Class Codes: F27B 17/0025 Especially adapted for treating semiconductor wafers
• CPC Class Codes: F27B 5/04 adapted for treating the charge in vacuum or special atmosphere
• CPC Class Codes: F27D 3/0084 Charging; Manipulation of SC or SC wafers
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of the bake plate when the substrate is placed on the bake plate, and exhaust bores for exhausting gas from the minute space. The substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores.

Claims

1. A substrate heat treatment apparatus for heat-treating a substrate, comprising:

a bake plate having projections on an upper surface thereof;

a seal unit disposed peripherally of the upper surface of said bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of said bake plate when the substrate is placed on said bake plate, said seal unit including a regulator for restricting sideways movement of the substrate and a contact portion having a diameter smaller than an outside diameter of the substrate and spaced from said regulator for contacting the lower surface of the substrate; and

exhaust bores for exhausting gas from said minute space;

wherein the substrate placed on said bake plate is heat-treated in a state of the gas exhausted from said minute space through said exhaust bores.

2. An apparatus as defined in claim 1, wherein said exhaust bores open to the upper surface of said bake plate.

3. An apparatus as defined in claim 2, wherein said exhaust bores are formed in positions closer to said seal unit than to a central part of said bake plate.

4. An apparatus as defined in claim 1, wherein said bake plate has a recessed shape with the upper surface recessed downward.

5. An apparatus as defined in claim 1, wherein said seal unit has a groove formed outwardly of the contact portion and between said regulator and said contact portion for remaining out of contact with the lower surface of the substrate.

6. An apparatus as defined in claim 2, wherein said seal unit has a groove formed outwardly of the contact portion and between said regulator and said contact portion for remaining out of contact with the lower surface of the substrate.

7. An apparatus as defined in claim 3, wherein said seal unit has a groove formed outwardly of the contact portion and between said regulator and said contact portion for remaining out of contact with the lower surface of the substrate.

8. An apparatus as defined in claim 1, further comprising feed bores for feeding a gas to said minute space, wherein the gas is fed from said feed bores and the exhaust from said exhaust bores is stopped after finishing heat treatment of the substrate.

9. An apparatus as defined in claim 2, further comprising feed bores for feeding a gas to said minute space, wherein the gas is fed from said feed bores and the exhaust from said exhaust bores is stopped after finishing heat treatment of the substrate.

10. An apparatus as defined in claim 3, further comprising feed bores for feeding a gas to said minute space, wherein the gas is fed from said feed bores and the exhaust from said exhaust bores is stopped after finishing heat treatment of the substrate.

11. An apparatus as defined in claim 1, further comprising:

an exhaust pressure detecting device for detecting an exhaust pressure in said exhaust bores;

a determining device for determining an abnormality of an exhaust system based on the exhaust pressure obtained from said exhaust pressure detecting device; and

a reporting device for reporting the abnormality determined by said determining device.

12. An apparatus as defined in claim 1, further comprising a switching device for switching an exhaust pressure from said exhaust bores, such that an exhaust pressure from said minute space is increased to be higher in early stages of exhaust than a subsequent exhaust pressure in time of steady state.

13. A substrate heat treatment apparatus for heat-treating a substrate, comprising:

a bake plate having projections on an upper surface thereof;

a seal unit disposed peripherally of the upper surface of said bake plate for closing a lateral area of a minute space formed under a lower surface of the substrate when the substrate is placed on said bake plate, said seal unit including a regulator for restricting sideways movement of the substrate and a contact portion having a diameter smaller than an outside diameter of the substrate and spaced from said regulator for contacting the lower surface of the substrate;

a porous member disposed on the upper surface of said bake plate inwardly of said seal unit; and

exhaust bores communicating with said porous member for exhausting gas from said minute space;

wherein the substrate placed on said bake plate is heat-treated in a state of the gas exhausted from said minute space through said exhaust bores.

14. An apparatus as defined in claim 13, wherein said exhaust bores open to the upper surface of said bake plate.

15. An apparatus as defined in claim 13, wherein said seal unit has a groove formed outwardly of the contact portion and between said regulator and said contact portion for remaining out of contact with the lower surface of the substrate.

16. An apparatus as defined in claim 14, wherein said seal unit has a groove formed outwardly of the contact portion and between said regulator and said contact portion for remaining out of contact with the lower surface of the substrate.

17. An apparatus as defined in claim 13, further comprising feed bores for feeding a gas to said minute space, wherein the gas is fed from said feed bores and the exhaust from said exhaust bores is stopped after finishing heat treatment of the substrate.

18. An apparatus as defined in claim 14, further comprising feed bores for feeding a gas to said minute space, wherein the gas is fed from said feed bores and the exhaust from said exhaust bores is stopped after finishing heat treatment of the substrate.

19. An apparatus as defined in claim 13, further comprising:

an exhaust pressure detecting device for detecting an exhaust pressure in said exhaust bores;

a determining device for determining an abnormality of an exhaust system based on the exhaust pressure obtained from said exhaust pressure detecting device; and

a reporting device for reporting the abnormality determined by said determining device.

20. An apparatus as defined in claim 13, further comprising a switching device for switching an exhaust pressure from said exhaust bores, such that an exhaust pressure from said minute space is increased to be higher in early stages of exhaust than a subsequent exhaust pressure in time of steady state.