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Method for stripping sacrificial layer in MEMS assembly

  • US 7,432,572 B2
  • Filed: 09/19/2005
  • Issued: 10/07/2008
  • Est. Priority Date: 06/04/2003
  • Status: Expired due to Term
First Claim
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1. A MEMS assembly constructed according to a process comprising:

  • mounting a MEMS device on an assembly substrate, the MEMS device having a sacrificial layer;

    coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, the coupling maintaining an opening to the interior of the MEMS assembly; and

    removing the sacrificial layer through the opening.

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