Electronic module and method for sealing an electronic module

• US 7,433,197 B2
• Filed: 08/28/2006
• Issued: 10/07/2008
• Est. Priority Date: 08/26/2005
• Status: Expired due to Fees

• Current Assignee: TK Holdings Incorporated (Ningbo Junsheng Investment Group Co., Ltd.)
• Original Assignee: TK Holdings Incorporated (Ningbo Junsheng Investment Group Co., Ltd.)
• Inventors: Steele, Ryan N.
• Primary Examiner(s): Bui; Hung S
• Application Number:
  US11/467,708
• Publication Number:
  US 20070049121A1
• Time in Patent Office: 771 Days
• Field of Search: 361/752, 361/790, 361/797, 361/800, 361/748, 361/767, 361/760, 312/223, 174/138.R, 174/138.G, 439625-626
• US Class Current: 361/752
• CPC Class Codes: B60R 16/0231 Circuits relating to the driving or the functioning of the vehicle monitoring tyres B60C23/00; indicating overspeed B60K31/00; for dash boards B60K37/00, B60Q3/10; for indicating emergencies B60Q1/52; brake control systems B60T; registering or indicating the working of vehicles G07C5/00; measuring distance G01C, e.g. combinations of speed and distance G01C23/00; engine indicators G01L; measuring speed or acceleration G01P
• CPC Class Codes: H01R 13/52 Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 13/6683 with built-in sensor
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/0078 specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
• CPC Class Codes: H05K 5/064 sealed by potting, e.g. waterproof resin poured in a rigid casing

Abstract

A method and apparatus for sealing electronic module conductors is provided. Electronic modules typically consist of an electronic circuit board (“PCB”) with electronic components, an integral housing/connector assembly, conductors such as wires or terminal pins, and a mounting feature. A method for sealing electronic module conductors is provided which improves the sealing properties around the conductors positioned on the first and second side of the PCB.

Claims

1. An electronic module, comprising:

an electronic module housing;

a printed circuit board, having a first and a second side and a leak path;

a potting well formed in the electronic module housing beneath the leak path on the underside of the printed circuit board;

a conductor connected to the housing and the printed circuit board such that the conductor is positioned in the potting well and is exposed on the first side of the printed circuit board, wherein the conductor is insulated by potting material and wherein the module is configured so that excess potting material collects in the potting well via the leak path; and

one or more electronic components positioned on the underside of the printed circuit board, wherein the potting well separates the conductor from the electronic components so as to prevent the circuit components from being exposed to the potting material.

2. The electronic module of claim 1, wherein the leak path is positioned between an edge of the printed circuit board and a surface of the electronic module housing.

3. The electronic module of claim 1, wherein the leak path is formed as a hole in the printed circuit board.

4. The electronic module of claim 1, wherein the conductors are terminal pins arranged to pass through the printed circuit board.

5. The electronic module of claim 1, wherein the conductors are wires soldered to the printed circuit board.

6. The electronic module of claim 1, wherein the electronic module is a crash sensor for sensing a vehicle impact and deploy an airbag.

7. The electronic module of claim 1, further comprising conductors connected to the housing and the printed circuit board such that the conductors are positioned in the potting well and are exposed on the first side of the printed circuit board.

8. The electronic module of claim 7, further comprising a potting material dispensed on the first side of the printed circuit board, dispensed in the leak path, and dispensed in the potting well.

9. The electronic module of claim 8, wherein a plurality of circuit components are positioned on the first and/or second side of the printed circuit board.