Method of fabricating a 3-D package stacking system

• US 7,435,619 B2
• Filed: 02/14/2006
• Issued: 10/14/2008
• Est. Priority Date: 02/14/2006
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Chow, Seng Guan, Han, Byung Joon, Shim, Il Kwon
• Primary Examiner(s): Chambliss; Alonzo
• Application Number:
  US11/307,615
• Publication Number:
  US 20070187826A1
• Time in Patent Office: 973 Days
• Field of Search: None
• US Class Current: 438/107
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1041 Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1052 Wire or wire-like electrical connections
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/03 : all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a lower package, the lower package having the ball grid array package and the substrate encapsulated by a molding compound and attaching a second integrated circuit package over the lower package.

Claims

1. A system for 3D package stacking system, comprising:

providing a substrate;

attaching a ball grid array package, in an inverted position, to the substrate;

forming a lower package, the lower package having the ball grid array package and the substrate encapsulated by a molding compound, wherein solder balls of the ball grid array package protrude from the molding compound of the lower package; and

attaching a second integrated circuit package over the lower package.

2. The system as claimed in claim 1 further comprising forming a BGA interposer in the ball grid array package.

3. The system as claimed in claim 1 further comprising attaching an encapsulated integrated circuit between the substrate and the ball grid array package within the lower package.

4. The system as claimed in claim 1 further comprising mounting an IC spacer over an integrated circuit die attached between the substrate and the ball grid array package.

5. The system as claimed in claim 1 further comprising applying an underfill material to stabilize the second integrated circuit package mounted over the lower package.

6. A 3D package stacking system, comprising:

providing a substrate having embedded components electrically attached to a top substrate surface;

attaching a ball grid array package, in an inverted position, to the substrate further comprises connecting a bond wire between the substrate and the ball grid array package;

forming a lower package, the lower package having the ball grid array package and the substrate encapsulated by a molding compound, wherein solder balls of the ball grid array package protrude from the molding compound of the lower package; and

attaching a second integrated circuit package over the lower package further comprises providing a signal path through the lower package to a printed circuit board interface.

7. The system as claimed in claim 6 further comprising forming a BGA interposer in the ball grid array package, wherein the BGA interposer establishes the connection pattern for the second integrated circuit package mounted over the lower package.

8. The system as claimed in claim 6 further comprising attaching an encapsulated integrated circuit between the substrate and the ball grid array package, wherein the encapsulated integrated circuit is electrically attached to the substrate and the ball grid array package.

9. The system as claimed in claim 6 further comprising utilizing an IC spacer over an integrated circuit die attached between the substrate and the ball grid array package, wherein the die is electrically attached to the substrate and the ball grid array package.

10. The system as claimed in claim 6 further comprising applying an underfill material to stabilize the second integrated circuit package mounted over the lower package.

11. A 3D package stacking system, comprising:

a substrate;

a ball grid array package, in an inverted position, attached to the substrate;

a lower package comprising the ball grid array package and the substrate encapsulated by a molding compound, wherein solder balls of the ball grid array package protrude from the molding compound of the lower package; and

a second integrated circuit package attached over the lower package.

12. The system as claimed in claim 11 further comprising a BGA interposer in the ball grid array package.

13. The system as claimed in claim 11 further comprising an encapsulated integrated circuit attached between the substrate and the ball grid array package.

14. The system as claimed in claim 11 further comprising an IC spacer mounted over an integrated circuit die attached between the substrate and the ball grid array package.

15. The system as claimed in claim 11 further comprising an underfill material to stabilize the second integrated circuit package mounted over the lower package.

16. The system as claimed in claim 11, wherein a substrate, a ball grid array package, in an inverted position, attached to the substrate, a lower package comprising the ball grid array package and the substrate encapsulated by a molding compound and a second integrated circuit package attached over the lower package;

further comprising;

embedded components electrically attached to a top substrate surface;

a bond wire connected between the substrate and the ball grid array package; and

a signal path for the second integrated circuit package through the lower package to a printed circuit board interface.

17. The system as claimed in claim 16 further comprising a BGA interposer in the ball grid array package, wherein the BGA interposer establishes the connection pattern for the second integrated circuit package mounted over the lower package.

18. The system as claimed in claim 16 further comprising an encapsulated integrated circuit attached between the substrate and the ball grid array package, wherein the encapsulated integrated circuit is electrically attached to the substrate and the ball grid array package.

19. The system as claimed in claim 16 further comprising an IC spacer, mounted over an integrated circuit die, attached between the substrate and the ball grid array package, wherein the die is electrically attached to the substrate and the ball grid array package.

20. The system as claimed in claim 16 further comprising an underfill material to stabilize the second integrated circuit package mounted over the lower package.