Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

• US 7,436,000 B2
• Filed: 06/22/2005
• Issued: 10/14/2008
• Est. Priority Date: 01/26/2005
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Yoon, Ju-Young, Park, Se-Ki, Kim, Gi-Cherl, Nam, Seok-Hyun, Lee, Sang-Yu, Yang, Byung-Choon
• Primary Examiner(s): Tran; Minh-Loan
• Assistant Examiner(s): LIU, BENJAMIN T
• Application Number:
  US11/158,644
• Publication Number:
  US 20060163596A1
• Time in Patent Office: 1,210 Days
• Field of Search: 257 98-100, 257/706, 257/E33.058, 257/E33.066, 257/E33.073, 257/E33.075, 257/707, 257/E33.059, 257/E33.067, 349/61, 349/62, 349/70, 349/63, 349/64, 349/65
• US Class Current: 257/98
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133607 the light controlling member including light directing or refracting elements, e.g. prisms or lenses
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0203 : Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/09481 : Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10553 : Component over metal, i.e. metal plate in between bottom of component and surface of PCB
• CPC Class Codes: H05K 3/445 : having insulated holes or insulated via connections through the metal core

Abstract

A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to the wires through the holes, a buffer layer covering the LED chip, and an optical layer that is disposed on the buffer layer and has an optical pattern formed at a portion of the optical layer corresponding to the LED chip.

Claims

1. A liquid crystal display (LCD) device comprising:

a two-dimensional light source; and

a liquid crystal panel assembly that is disposed proximate to the two-dimensional light source and includes two panels and a liquid crystal layer interposed between the two panels,

wherein the two-dimensional light source includes;

a printed circuit board (PCB) substrate having holes passing from a lower surface to an upper surface of the PCB substrate;

wires disposed on the lower surface of the PCB substrate;

a heat radiating substrate, which has holes passing from a lower surface to an upper surface of the heat radiating substrate, the lower surface of the heat radiating substrate being attached to the upper surface of the PCB substrate;

a light emitting diode (LED) chip disposed on the upper surface of the heat radiating substrate;

plugs that connect electrodes of the LED chip directly to the wires through the holes of the PCB and heat radiating substrates;

a buffer layer disposed directly on the LED chip that covers the LED chip; and

an optical layer, which is disposed on the buffer layer, and includes an optical pattern formed at a portion of the optical layer corresponding to the LED chip.

2. The liquid crystal display device of claim 1, further comprising a first polarizer disposed on a first side of the liquid crystal panel assembly and a second polarizer disposed on a second side of the liquid crystal panel assembly.

3. The liquid crystal display device of claim 1, further comprising an optical film provided between the two-dimensional light source and the liquid crystal panel assembly.

4. The liquid crystal display device of claim 1, wherein the buffer layer has a planarized upper surface.