Optical device and method for fabricating the same
First Claim
Patent Images
1. An optical device comprising:
- a base of a molding resin having an opening and formed with a shoulder whose upper level is on an upper region of a lower surface of the base surrounding proximity of the opening;
a lead which is partly buried in the molding resin and which has an external terminal portion provided in the lower region of a lower surface of the base and an internal terminal portion provided in the upper region of the lower surface of the base and bent up above the external terminal portion;
a translucent member attached to an upper surface of the base and covering the opening; and
an optical element chip of which a main surface is placed on the upper region of the lower surface of the base to face the translucent member with the opening interposed therebetween, the optical element chip mounting an optical element electrically connected to the internal terminal portion of the lead.
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Abstract
An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.
7 Citations
16 Claims
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1. An optical device comprising:
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a base of a molding resin having an opening and formed with a shoulder whose upper level is on an upper region of a lower surface of the base surrounding proximity of the opening; a lead which is partly buried in the molding resin and which has an external terminal portion provided in the lower region of a lower surface of the base and an internal terminal portion provided in the upper region of the lower surface of the base and bent up above the external terminal portion; a translucent member attached to an upper surface of the base and covering the opening; and an optical element chip of which a main surface is placed on the upper region of the lower surface of the base to face the translucent member with the opening interposed therebetween, the optical element chip mounting an optical element electrically connected to the internal terminal portion of the lead. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An optical device comprising:
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a base of a molding resin having an opening and formed with a step in a lower surface of the base so as to have a thin portion surrounding proximity of the opening and a thick portion in a peripheral region; a lead buried in the base so that an internal terminal portion provided is exposed in a lower surface of the thin portion of the base and an external terminal portion is exposed in a lower surface of the thick portion of the base; a translucent member attached to an upper surface of the base and covering the opening; and an optical element chip disposed on the thin portion of the base so that the optical element chip electrically connects to the internal terminal portion via a bump. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification