MEMS microphone with a stacked PCB package and method of producing the same

• US 7,436,054 B2
• Filed: 03/03/2006
• Issued: 10/14/2008
• Est. Priority Date: 03/03/2006
• Status: Active Grant

• Current Assignee: Shandong Gettop Acoustic Company Limited (Weifang Gaoke Electronic Company Limited)
• Original Assignee: Silicon Matrix Pte., Ltd.
• Inventors: Zhe, Wang
• Primary Examiner(s): DANG, TRUNG Q
• Application Number:
  US11/368,172
• Publication Number:
  US 20070205492A1
• Time in Patent Office: 956 Days
• Field of Search: 257/E23.003, 438/51
• US Class Current: 257/686
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one MEMS acoustic sensor device wherein an edge surface of the metal cap structure is attached and electrically connected to the PCB stack. In a first embodiment, a back chamber is formed underlying the at least one MEMS acoustic sensor device and within the PCB stack wherein an opening underlying the at least one MEMS acoustic sensor device accesses the back chamber. An opening in the metal cap structure not aligned with the at least one MEMS acoustic sensor device allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device. In a second embodiment, a back chamber is formed in the space under the metal cap and over the first PCB. A hollow chamber is formed between the first PCB and the second PCB wherein an opening under the at least one MEMS acoustic sensor device accesses the hollow chamber. An opening in a bottom surface of the PCB stack not aligned with the at least one MEMS acoustic sensor device also accesses the hollow chamber and allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device.

Claims

1. A MEMS package comprising:

at least one MEMS acoustic sensor device;

a PCB stack on which said at least one MEMS acoustic sensor device and one or more electronic components are mounted;

a metal cap structure surrounding said at least one MEMS acoustic sensor device and said one or more electronic components wherein an edge surface of said metal cap structure is attached and electrically connected to said PCB stack wherein an opening in said metal cap structure is not aligned with said at least one MEMS acoustic sensor device and wherein said opening allows external fluid, acoustic energy or pressure to enter said at least one MEMS acoustic sensor device; and

a back chamber formed underlying said at least one MEMS acoustic sensor device and within said PCB stack wherein an opening underlying said at least one MEMS acoustic sensor device accesses said back chamber.

2. The package according to claim 1 wherein said PCB stack comprises a first PCB and a second PCB.

3. The package according to claim 2 wherein said first PCB and said second PCB each comprise patterned metal layers and solder resist layers on top and bottom sides.

4. The package according to claim 1 wherein said metal cap structure comprises a copper, a copper alloy, an aluminum alloy, an iron alloy with solderable metal finish, a plastic with a metal finish formed by either electroless plating or painting, or a conductive composite material formed by either injection molding or transfer molding.

5. The package according to claim 2 wherein said first and second PCB'"'"'s are attached by a soldering process.

6. The package according to claim 1 wherein said one or more electronic components comprise at least one integrated circuit and may comprise one or more passive components.

7. The package according to claim 6 further comprising wire bonding connections among said one or more electronic components, said at least one MEMS acoustic sensor device, and said PCB stack.

8. A MEMS package comprising:

at least one MEMS acoustic sensor device and one or more electronic components;

a PCB stack on a top surface of which said at least one MEMS acoustic sensor device and said one or more electronic components are mounted;

a metal cap structure surrounding said at least one MEMS acoustic sensor device and said one or more electronic components wherein an edge surface of said metal cap structure is attached and electrically connected to said PCB stack; and

a back chamber formed within said metal cap above said at least one MEMS acoustic sensor device and said top surface of said PCB stack wherein an opening underlying said at least one MEMS acoustic sensor device accesses a hollow chamber within said PCB stack and wherein an opening in a bottom surface of said PCB stack is not aligned with said at least one MEMS acoustic sensor device and wherein said opening and said hollow chamber allow external fluid, acoustic energy or pressure to enter said at least one MEMS acoustic sensor device.

9. The package according to claim 8 wherein said PCB stack comprises a first PCB and a second PCB.

10. The package according to claim 9 wherein said first PCB and said second PCB each comprise metal layers on both sides.

11. The package according to claim 8 wherein said metal cap structure comprises a copper, a copper alloy, an aluminum alloy, an iron alloy with solderable metal finish, a plastic with a metal finish formed by either electroless plating or painting, or a conductive composite material formed by either injection molding or transfer molding.

12. The package according to claim 9 wherein said first and second PCB'"'"'s are attached by a soldering process.

13. The package according to claim 8 wherein said one or more electronic components comprise at least one integrated circuit and may comprise one or more passive components.

14. The package according to claim 13 further comprising wire bonding connections among said one or more electronic components, said at least one MEMS acoustic sensor device, and said PCB stack.

15. A method for fabricating a MEMS acoustic sensor device in a stacked PCB package comprising:

providing a first PCB;

mounting said MEMS acoustic sensor device and one or more electronic components on a top surface of said first PCB;

mounting a metal cap structure on said top surface of said first PCB and encapsulating said MEMS acoustic sensor device; and

mounting a second PCB on a bottom surface of said first PCB wherein a hollow chamber is formed between said first PCB and said second PCB and wherein an opening underlying said MEMS acoustic sensor device accesses said hollow chamber to complete said fabricating said MEMS acoustic sensor device in said stacked PCB package.

16. The method according to claim 15 further comprising mounting at least one passive device to said top surface of said first PCB and within said metal cap structure using solder paste and surface mount technology.

17. The method according to claim 15 wherein said hollow chamber forms a back chamber for said MEMS acoustic sensor device and wherein an opening in said metal cap structure not aligned with said MEMS acoustic sensor device allows external fluid, acoustic energy or pressure to enter said MEMS acoustic sensor device.

18. The method according to claim 15 wherein a back chamber is formed within a space bounded by said metal cap and said first PCB and wherein an opening in said bottom surface of said second PCB to said hollow chamber, wherein said opening is not aligned with said MEMS acoustic sensor device, allows external fluid, acoustic energy or pressure to enter said MEMS acoustic sensor device.

19. The method according to claim 15 wherein said mounting said MEMS acoustic sensor device to said first PCB comprises applying adhesive to said MEMS acoustic sensor device and attaching said MEMS acoustic sensor device to said PCB by said adhesive.

20. The method according to claim 15 wherein said mounting said metal cap structure on said top surface of said first PCB comprises:

screen printing solder paste on said top surface of said first PCB prior to said mounting said MEMS acoustic sensor device and one or more electronic components;

dipping edges of said metal cap structure into solder flux; and

attaching said metal cap structure to said solder paste on said first PCB using a solder reflow process.

21. The method according to claim 15 wherein said mounting said metal cap structure on said top surface of said first PCB comprises:

dispensing any conductive adhesive on said top surface of said first PCB; and

attaching said metal cap structure to said conductive adhesive on said first PCB.

22. The method according to claim 15 wherein said mounting said second PCB on said bottom surface of said first PCB comprises:

screen printing solder paste on a top surface of said second PCB;

aligning said first PCB and said second PCB; and

attaching said first PCB to said second PCB using a solder reflow process.

23. The method according to claim 15 wherein said one or more electronic components comprise at least one integrated circuit device wherein said at least one integrated circuit device is mounted to said top surface of said first PCB and within said metal cap structure using an adhesive.

24. The method according to claim 23 further comprising wirebonding said at least one integrated circuit device to said first PCB and to said MEMS acoustic sensor device.

25. The method according to claim 15 after said mounting a second PCB on a bottom surface of said first PCB, further comprising singulating said stacked PCB package into individual package units.