Acoustically coupled resonators and method of making the same

• US 7,436,269 B2
• Filed: 04/18/2005
• Issued: 10/14/2008
• Est. Priority Date: 04/18/2005
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies Wireless IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Ruby, Richard C., Bradley, Paul D., Wang, Kun
• Primary Examiner(s): Summons; Barbara
• Application Number:
  US11/109,596
• Publication Number:
  US 20060232361A1
• Time in Patent Office: 1,275 Days
• Field of Search: 333/133, 333/189
• US Class Current: 333/133
• CPC Class Codes: H03H 2003/0428 of an electrode
• CPC Class Codes: H03H 3/02 for the manufacture of piezoelectric or electrostrictive resonators or networks H03H3/08 takes precedence
• CPC Class Codes: H03H 7/1708 Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path H03H7/07 takes precedence
• CPC Class Codes: H03H 9/0095 using bulk acoustic wave devices
• CPC Class Codes: H03H 9/0571 including bulk acoustic wave [BAW] devices
• CPC Class Codes: H03H 9/583 comprising a plurality of piezoelectric layers acoustically coupled
• CPC Class Codes: H03H 9/584 Coupled Resonator Filters [CFR]
• CPC Class Codes: H03H 9/587 Air-gaps
• CPC Class Codes: H03H 9/706 Duplexers
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

An apparatus includes a substrate with a cavity and a two-stage resonator filter fabricated over the cavity. The two-stage resonator filter includes a first stage and a second stage. The first stage includes a first resonator and a second resonator, the second resonator acoustically coupled to the first resonator. The second stage includes a third resonator and a fourth resonator, the fourth resonator acoustically coupled to the third resonator. The second resonator and the third resonators are electrically coupled. A decoupling layer couples the first resonator and the second resonator. The decoupling layer extends between the third resonator and the fourth resonator. The first resonator and the fourth resonator are above the substrate. The decoupling layer is above the first resonator and the fourth resonator. The second resonator and the third resonators are above the decoupling layer.

Claims

1. A single-chip duplexer comprising:

a first two-stage resonator filter configured to pass electrical signal having a frequency within a first range of frequencies, said first two-stage resonator filter including an input resonator, an output resonator, and two floating resonators, each resonator including piezoelectric material;

a second two-stage resonator filter configured to pass electrical signal having a frequency within a second range of frequencies, said second two-stage resonator filter including an input resonator, an output resonator, and two floating resonators, each resonator including piezoelectric material;

wherein a lower common piezoelectric layer is shared by said first two-stage resonator filter and by said second two-stage resonator filter; and

wherein an upper common piezoelectric layer is shared by said first two-stage resonator filter and by said second two-stage resonator filter.

2. The single-chip duplexer recited in claim 1 wherein the first range of frequencies is within the order of one to two Giga hertz.

3. The single-chip duplexer recited in claim 1 wherein a decoupling layer is shared by said first two-stage resonator filter and by said second two-stage resonator filter.

4. An apparatus comprising:

a two-stage resonator filter connected to two input signal lines and two output signal lines, said two-stage resonator filter comprising;

a first stage including an input resonator fabricated proximal to a substrate, the two input signal lines coupled to the input resonator; and

a first floating resonator fabricated above the input resonator distal from the substrate;

a second stage including an output resonator fabricated proximal to the substrate, the two output signal lines coupled to the output resonator; and

a second floating resonator fabricated above the output resonator distal from the substrate;

a decoupling layer between said input resonator and said first floating resonator, said decoupling layer extending between said second floating resonator and said output resonator;

at least one of

a first shunt resonator across the input signal lines;

a second shunt resonator across the output signal lines;

a first series resonator along its input signal lines; and

a second series resonator along its output signal lines.

5. An apparatus comprising:

a two-stage resonator filter connected to two input signal lines and two output signal lines, said two-stage resonator filter comprising;

a first stage including an input resonator fabricated proximal to a substrate, the two input signal lines coupled to the input resonator; and

a first floating resonator fabricated above the input resonator distal from the substrate;

a second stage including an output resonator fabricated proximal to the substrate, the two output signal lines coupled to the output resonator; and

a second floating resonator fabricated above the output resonator distal from the substrate;

a decoupling layer between said input resonator and said first floating resonator, said decoupling layer extending between said second floating resonator and said output resonator;

a first bridge capacitor bridging the input signal line and the second resonator; and

a second bridge capacitor bridging the output signal line and the third resonator.

6. The apparatus recited in claim 5, wherein

a first of the two input signal lines is coupled to the input resonator through a first connection pad located on the substrate;

and

a first of the two output signal lines is coupled to the output resonator through a second connection pad located on the substrate, the first connection pad being independent of the second connection pad.