Heat sinks for electronic enclosures

• US 7,436,660 B2
• Filed: 12/13/2006
• Issued: 10/14/2008
• Est. Priority Date: 12/13/2005
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Pedoeem, Albert, Replogle, Kriss K.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/637,840
• Publication Number:
  US 20070171614A1
• Time in Patent Office: 671 Days
• Field of Search: None
• US Class Current: 361/690
• CPC Class Codes: H04J 2203/0094 Virtual Concatenation
• CPC Class Codes: H04J 3/1694 Allocation of channels in TDM/TDMA networks, e.g. distributed multiplexers Passive Optical Networks H04Q11/0062
• CPC Class Codes: H04L 12/18 for broadcast or conference , e.g. multicast
• CPC Class Codes: H04L 41/0213 Standardised network management protocols, e.g. simple network management protocol [SNMP]
• CPC Class Codes: H04L 41/024 using relational databases for representation of network management data, e.g. managing via structured query language [SQL]
• CPC Class Codes: H04L 41/042 comprising distributed management centres cooperatively managing the network
• CPC Class Codes: H04L 41/0806 for initial configuration or provisioning, e.g. plug-and-play
• CPC Class Codes: H04L 41/0856 by backing up or archiving configuration information
• CPC Class Codes: H04L 41/5054 Automatic deployment of services triggered by the service manager, e.g. service implementation by automatic configuration of network components
• CPC Class Codes: H04L 41/509 wherein the managed service relates to media content delivery, e.g. audio, video or TV
• CPC Class Codes: H04L 43/50 Testing arrangements
• CPC Class Codes: H04L 45/16 Multipoint routing
• CPC Class Codes: H04L 49/15 Interconnection of switching modules
• CPC Class Codes: H04L 49/1523 Parallel switch fabric planes
• CPC Class Codes: H04L 49/30 Peripheral units, e.g. input or output ports
• CPC Class Codes: H04L 49/351 for local area network [LAN], e.g. Ethernet switches
• CPC Class Codes: H04L 49/352 Gigabit ethernet switching [GBPS]
• CPC Class Codes: H04L 49/357 Fibre channel switches
• CPC Class Codes: H04L 49/50 Overload detection or protection within a single switching element
• CPC Class Codes: H04Q 11/0062 Network aspects
• CPC Class Codes: H04Q 11/0067 : Provisions for optical access or distribution networks, e.g. Gigabit Ethernet Passive Optical Network (GE-PON), ATM-based Passive Optical Network (A-PON), PON-Ring
• CPC Class Codes: H04Q 11/0071 : Provisions for the electrical-optical layer interface
• CPC Class Codes: H04Q 2011/0079 : Operation or maintenance aspects
• CPC Class Codes: H04Q 2011/0083 : Testing; Monitoring
• CPC Class Codes: H04Q 2011/0084 : Quality of service aspects
• CPC Class Codes: H05K 7/20009 : using a gaseous coolant in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/202 : Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
• CPC Class Codes: Y04S 40/00 : Systems for electrical power generation, transmission, distribution or end-user application management characterised by the use of communication or information technologies, or communication or information technology specific aspects supporting them

Abstract

An apparatus for cooling electronics is disclosed. The apparatus generally relates to heat sinks that are operatively connected to electronics enclosures. The heat sinks may be part of the electronics enclosure, or alternately they may be operatively connected to the electronics enclosure. An enclosure preferably prevents solar radiation from striking the surface of the heat sink. At the same time, the enclosure allows air to flow over the heat sink, allowing heat to be dissipated.

Claims

1. An apparatus for cooling electronics, comprising:

an enclosure comprising a first compartment and a second compartment, wherein the second compartment comprises an opening in one wall, wherein the first compartment includes electronics therein, and wherein a portion of the first compartment is selectively positioned within a cavity of the second compartment; and

a heat sink operatively connected to a portion of the first compartment and a portion of the second compartment, wherein the operative connection between the heat sink and the portion of the second compartment forms a seal, and wherein the heat sink comprises a first part and a second part and a cavity between the first part and the second part.

2. The apparatus of claim 1, further comprising an outer enclosure operatively connected to the second compartment to surround the wall of the second compartment comprising an opening, wherein the outer enclosure comprises a plurality of perforations.

3. The apparatus of claim 2, wherein the connection between the outer enclosure and the second compartment forms a cavity into which the heat sink protrudes.

4. The apparatus of claim 3, wherein the exposure of the heat sink to solar radiation is substantially minimized.

5. The apparatus of claim 3, wherein heat is transferred from the heat sink to air in the cavity via conduction.

6. The apparatus of claim 1, wherein the electronics are operatively connected to the first compartment using one or more thermal conductive bonds.

7. The apparatus of claim 1, wherein a portion of the first compartment that is exposed to the cavity of the second compartment comprises two or more perforations.

8. An apparatus for cooling electronic devices, comprising:

a first enclosure comprising a heat sink, wherein a portion of the first enclosure houses electronics therein; and

a second sealed enclosure surrounding the first enclosure, wherein the heat sink of the first enclosure is operatively connected to a portion of the second sealed enclosure;

wherein the heat sink comprises a plurality of protrusions and the portion of the second sealed enclosure operatively connected to the protrusions is configured and dimensioned to include a plurality of recesses that correspond to the plurality of protrusions.

9. The apparatus of claim 8, further comprising a thermal bond between the electronics and the heat sink.

10. The apparatus of claim 8, wherein the second sealed enclosure comprises plastic.

11. The apparatus of claim 8, further comprising a gap between the top of each of the plurality of protrusions and the bottom of each of the plurality of recesses.

12. The apparatus of claim 8, wherein the heat sink further comprises a plurality of recesses between the plurality of protrusions and the second sealed enclosure includes a plurality of protrusions corresponding to the plurality of recesses, further comprising a gap between the bottom of each of the plurality of recesses of the heat sink and the top of the plurality of protrusions of the second sealed enclosure.

13. The apparatus of claim 8, further comprising a third enclosure operatively connected to the second enclosure to form a cavity therebetween, wherein the outer enclosure comprises a plurality of perforations.

14. The apparatus of claim 8, wherein at least a portion of the heat sink protrudes into the cavity.

15. The apparatus of claim 13, wherein the exposure of the heat sink to solar radiation is substantially minimized.

16. The apparatus of claim 13, wherein heat is transferred from the heat sink to air in the cavity via conduction.

17. The apparatus of claim 8, wherein the first enclosure comprises a plurality of perforations.

18. An apparatus for cooling electronics, comprising:

a first enclosure comprising a heat sink, wherein a portion of the first enclosure houses electronics therein; and

a second enclosure surrounding the first enclosure, wherein the heat sink of the first enclosure contacts a portion of the second enclosure;

wherein the surface of the heat sink that contacts a portion of the second enclosure is non-planar.

19. The apparatus of claim 18, further comprising a third enclosure operatively connected to the second enclosure to form a cavity therebetween, wherein the outer enclosure comprises a plurality of perforations.