Portable electronic apparatus and BGA package protective device

• US 7,436,676 B2
• Filed: 06/07/2002
• Issued: 10/14/2008
• Est. Priority Date: 09/14/2001
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Yamada, Taku, Nagaike, Shotaro, Higuchi, Toshihiro, Inomata, Yoji
• Primary Examiner(s): Bui; Hung S
• Application Number:
  US10/489,498
• Publication Number:
  US 20040235538A1
• Time in Patent Office: 2,321 Days
• Field of Search: 361/752, 361/790, 361/800, 361/816, 361/818, 361/797, 174/51, 174/35.R, 455/575
• US Class Current: 361/752
• CPC Class Codes: H01H 2239/01 combined with other elements on the same substrate
• CPC Class Codes: H04B 1/3833 Hand-held transceivers
• CPC Class Codes: H04M 1/23 Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof by improving visibility H04M1/22
• CPC Class Codes: H04M 1/72427 for supporting games or graphical animations
• CPC Class Codes: H05K 9/0037 Housings with compartments containing a PCB, e.g. partitioning walls

Abstract

A portable electronic device in which microswitches (12) controlled by operation buttons (11) are mounted on one side of a printed circuit board (13), and circuit elements accommodated in BGA packages (14), (15) and (16) are soldered on the other side of the printed circuit board. In the portable electronic device, a shield wall (22) for surrounding the BGA packages (14), (15) and (16) is mounted on the printed circuit board (13), a first protrusion portion (18b) for holding down the shield wall (22) on the printed circuit board (13) is protruded from a case (18) of the portable electronic device (10), and second protrusion portion (18c) for holding down surfaces of the BGA packages (14); (15) and (16) on the printed circuit board (13) is protruded from the case (18) of the portable electronic device (10). With such a construction, the BGA packages are prevented from being peeled off from the printed circuit board (13). Further, even when the push buttons are frequently depressed in playing a game, the soldering parts of the BGA packages mounted on the back side of the operation button can be maintained in good conditions.

Claims

1. A portable electronic device in which microswitches controlled by operation buttons are mounted on one side of a printed circuit board, and an electronic component containing a circuit element is soldered on the other side of the printed circuit board, the portable electronic device is characterized in that:

the electronic component and the microswitches face to each other across the printed circuit board,

a shield wall for surrounding the electronic components is mounted on the printed circuit board,

a shield cover covers an upper surface of the shield wall, and

a protrusion portion for holding down the shield wall on the printed circuit board is protruded from a case of the portable electronic device.

2. The portable electronic device according to claim 1, wherein the printed circuit board is restricted from being deformed within an area surrounded by the shield wall.

3. A portable electronic device in which microswitches controlled by operation buttons are mounted on one side of a printed circuit board, and an electronic component containing a circuit element is soldered on the other side of the printed circuit board, the portable electronic device is characterized in that:

a shield wall for surrounding the electronic components is mounted on the printed circuit board;

a first protrusion portion for holding down the shield wall on the printed circuit board is protruded from a case of the portable electronic device; and

a second protrusion portion for holding down a surface of the electronic components on the printed circuit board is protruded from the case of the portable electronic device.

4. An electronic component protecting device for protecting soldering parts of an electronic component soldered on a printed circuit board, the electronic component protecting device is characterized in that:

a shield wall for surrounding the electronic components is mounted on the printed circuit board; and

a case of the portable electronic device includes a first member for holding down the shield wall on the printed circuit board and second members for holding down a surface of the electronic components on the printed circuit board.

5. The electronic component protecting device according to claim 4, wherein the printed circuit board is restricted from being deformed within an area surrounded by the shield wall.

6. A portable electronic device in which microswitches controlled by operation buttons are mounted on one side of a printed circuit board, and an electronic component containing a circuit element is soldered on the other side of the printed circuit board, the portable electronic device is characterized in that:

a protrusion portion for holding down a surface of the electronic components on said printed circuit board is protruded from a case of the portable electronic device;

the electronic component and the microswitches face to each other across the printed circuit board; and

a shield member for surrounding the electronic component is mounted on the printed circuit board, the shield member having an insertion hole,

wherein the protrusion portion passes through the insertion hole of the shield member and reaches the surface of the electronic component.

7. An electronic component protecting device for protecting soldering parts of an electronic component soldered on a printed circuit board, the electronic component protecting device, comprising:

a shield member for surrounding the electronic component is mounted on the printed circuit board, and the shield member having an insertion hole; and

a protrusion portion for holding down a surface of the electronic component on the printed circuit board is protruded from a case of the portable electronic device,

wherein the protrusion portion passes through the insertion hole of the shield member and reaches the surface of the electronic component.