Ruthenium containing layer deposition method
First Claim
1. A method of forming a ruthenium containing layer on a substrate surface, comprising:
- forming a ruthenium tetroxide in a first vessel;
delivering an amount of the ruthenium tetroxide contained in the first vessel to a second vessel;
purging the second vessel to remove unwanted contaminants after the amount of the ruthenium tetroxide has been delivered to the second vessel from the first vessel; and
delivering an amount of ruthenium tetroxide contained in the second vessel to a substrate positioned on a substrate support in a vacuum processing chamber after purging the second vessel for a period of time, wherein the second vessel has a surface that is maintained at a temperature below about 25°
C. when the amount of ruthenium tetroxide is delivered.
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Accused Products
Abstract
An exemplary apparatus and method of forming a ruthenium tetroxide containing gas to form a ruthenium containing layer on a surface of a substrate is described herein. The method and apparatus described herein may be especially useful for fabricating electronic devices that are formed on a surface of the substrate or wafer. Generally, the method includes exposing a surface of a substrate to a ruthenium tetroxide vapor to form a catalytic layer on the surface of a substrate and then filling the device structures by an electroless, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), atomic layer deposition (ALD) or plasma enhanced ALD (PE-ALD) processes. In one embodiment, the ruthenium containing layer is formed on a surface of a substrate by creating ruthenium tetroxide in an external vessel and then delivering the generated ruthenium tetroxide gas to a surface of a temperature controlled substrate positioned in a processing chamber. In one embodiment, a ruthenium tetroxide containing solvent formation process is used to form ruthenium tetroxide using a ruthenium tetroxide containing source material. In one embodiment, of a ruthenium containing layer is formed on a surface of a substrate, using the ruthenium tetroxide containing solvent. In another embodiment, the solvent is separated from the ruthenium tetroxide containing solvent mixture and the remaining ruthenium tetroxide is used to form a ruthenium containing layer on the surface of a substrate.
111 Citations
21 Claims
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1. A method of forming a ruthenium containing layer on a substrate surface, comprising:
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forming a ruthenium tetroxide in a first vessel; delivering an amount of the ruthenium tetroxide contained in the first vessel to a second vessel; purging the second vessel to remove unwanted contaminants after the amount of the ruthenium tetroxide has been delivered to the second vessel from the first vessel; and delivering an amount of ruthenium tetroxide contained in the second vessel to a substrate positioned on a substrate support in a vacuum processing chamber after purging the second vessel for a period of time, wherein the second vessel has a surface that is maintained at a temperature below about 25°
C. when the amount of ruthenium tetroxide is delivered. - View Dependent Claims (2, 3, 4, 5)
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6. A method of forming a ruthenium containing layer on a substrate surface, comprising:
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forming a ruthenium tetroxide containing gas in a first vessel; delivering an amount of the ruthenium tetroxide containing gas from the first vessel to a second vessel; collecting a desired amount of ruthenium tetroxide from the ruthenium tetroxide containing gas on a surface of the second vessel that is maintained at a first temperature; purging the second vessel to remove unwanted contaminants contained in the second vessel; vaporizing an amount of the ruthenium tetroxide found on the surface of the second vessel; and delivering an amount of the vaporized ruthenium tetroxide from the second vessel to a substrate positioned on a substrate support in a processing chamber to form a ruthenium containing layer on a surface of the substrate. - View Dependent Claims (7, 8, 9)
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10. A method of forming a ruthenium containing layer on a substrate surface, comprising:
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providing a solvent mixture that comprises a solvent and ruthenium tetroxide, wherein the solvent is selected from the group consisting of perfluorocarbons, hydroflurocarbons and chlorofluorocarbons; and delivering the solvent mixture to a substrate positioned on a substrate support in a processing chamber. - View Dependent Claims (11, 12)
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13. A method of forming a ruthenium containing layer on a substrate surface, comprising:
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providing an aqueous solution that comprises a perruthenate material, water and a hypochlorite containing material; adding an amount of an acid to the aqueous solution adding a solvent to the aqueous solution to form a solvent containing mixture, wherein the solvent is selected from the group consisting of perfluorocarbons, hydroflurocarbons and chlorofluorocarbons; removing the water from the solvent containing mixture; separating the ruthenium tetroxide from the solvent containing mixture; and delivering the ruthenium tetroxide to a substrate positioned on a substrate support in a processing chamber. - View Dependent Claims (14, 15, 16)
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17. A method of forming a ruthenium containing layer on a substrate surface, comprising:
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forming a ruthenium tetroxide containing mixture that comprises ruthenium tetroxide and a solvent; collecting the ruthenium tetroxide containing mixture in a first vessel that is located at a first location; transporting the first vessel to a second location, wherein the first vessel has the ruthenium tetroxide containing mixture disposed therein; connecting the first vessel to a processing chamber after transporting the first vessel; separating the ruthenium tetroxide from the solvent; and removing unwanted contaminants from the ruthenium tetroxide that has been separated from the solvent, wherein removing unwanted contaminants from the ruthenium tetroxide is performed before delivering an amount of the ruthenium tetroxide to a substrate positioned on a substrate support in the processing chamber, wherein the solvent is selected from the group consisting of perfluorocarbons, hydroflurocarbons and chlorofluorocarbons. - View Dependent Claims (18, 19, 20, 21)
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Specification