×

Miniature silicon condenser microphone

DC
  • US 7,439,616 B2
  • Filed: 02/10/2006
  • Issued: 10/21/2008
  • Est. Priority Date: 11/28/2000
  • Status: Expired due to Term
First Claim
Patent Images

1. A package for containing a transducer comprising:

  • a substrate including a surface and an aperture formed therein, the transducer attached to the surface of the substrate adjacent the aperture;

    a cover secured to the substrate defining a volume, the transducer unit being disposed within the volume; and

    a sealing ring being formed on a surface of the substrate opposite the volume, the sealing ring surrounding the aperture formed in the substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×