Miniature silicon condenser microphone
DCFirst Claim
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1. A package for containing a transducer comprising:
- a substrate including a surface and an aperture formed therein, the transducer attached to the surface of the substrate adjacent the aperture;
a cover secured to the substrate defining a volume, the transducer unit being disposed within the volume; and
a sealing ring being formed on a surface of the substrate opposite the volume, the sealing ring surrounding the aperture formed in the substrate.
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Abstract
A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.
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Citations
21 Claims
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1. A package for containing a transducer comprising:
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a substrate including a surface and an aperture formed therein, the transducer attached to the surface of the substrate adjacent the aperture; a cover secured to the substrate defining a volume, the transducer unit being disposed within the volume; and a sealing ring being formed on a surface of the substrate opposite the volume, the sealing ring surrounding the aperture formed in the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification