Capillary underflow integral heat spreader

• US 7,439,617 B2
• Filed: 06/30/2006
• Issued: 10/21/2008
• Est. Priority Date: 06/30/2006
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Shi, Wei, Hua, Fay, Deppisch, Carl, Fitzgerald, Tom, Gasparek, Mike
• Primary Examiner(s): Smith; Zandra
• Assistant Examiner(s): Green; Telly D
• Application Number:
  US11/479,577
• Publication Number:
  US 20080017975A1
• Time in Patent Office: 844 Days
• Field of Search: 257712-722, 257/439, 257/468, 257/625, 257/675, 257705-708, 438/117, 438/122
• US Class Current: 257/707
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1617 Cavity coating

Abstract

A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.

A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.

Claims

1. A cooling device, comprising:

a thermally conductive body having a first mating surface;

a solder wettable material disposed in a first pattern over at least a portion of the first mating surface; and

a concavity formed into the first mating surface of the thermally conductive body, the concavity being configured to receive a reflowable solder material therein, the concavity further having a tapered depth that is shallower proximate to the first pattern of solder wettable material.

2. The cooling device of claim 1, wherein a second pattern of solder wettable material is disposed at a surface of the concavity.

3. The cooling device of claim 1, wherein the concavity defines a volume adapted to contain a sufficient amount of solder material to substantially fill a bond line gap formed between the first mating surface and a second mating surface of a device to be cooled when the device to be cooled is thermally coupled to the cooling device.

4. The cooling device of claim 1, further comprising a bond line spacer projecting from the first mating surface.

5. The cooling device of claim 1, wherein the solder material is selected from the group consisting of indium, an indium alloy, lead, a lead alloy, a silver alloy, a tin alloy, a copper alloy, a bismuth alloy, a gold alloy, a phase change polymer material, and a metallic, particle-filled solder material, or some combination thereof.

6. The cooling device of claim 5, wherein the particles comprise at least one thermally conductive material different from the metallic solder material.

7. The cooling device of claim 1, wherein the solder wettable material is selected from the group consisting of gold, platinum, palladium, silver, tin, copper, and nickel.

8. The cooling device of claim 1, comprising at least one of an integral heat spreader (IHS), a passive heat dissipation device, or an active heat dissipation device.

21. The cooling device of claim 1, further comprising a reflowable solder material disposed within the concavity such that, when a portion of the solder material contacts the second mating surface and the solder material is exposed to reflow conditions, the solder material melts and forms a single flow front through a bond line gap between the first and second mating surfaces.

9. An assembly method, comprising:

disposing a cooling device adjacent to a thermal component, the cooling device comprising;

a thermally conductive body having a first mating surface;

a solder wettable material disposed in a first pattern over at least a portion of the first mating surface;

a concavity formed into the first mating surface of the thermally conductive body, the concavity further having a tapered depth that is shallower proximate to the first pattern of solder wettable material; and

a reflowable solder material disposed within the concavity such that, when a portion of the solder material contacts a second mating surface of the thermal component and the solder material is exposed to reflow conditions, the solder material melts and forms a single flow front through a bond line gap between the first and second mating surfaces;

exposing the solder material to reflow conditions, including heating the solder material at least to its melting point;

maintaining the solder material in a molten state until it substantially fills the bond line gap; and

reducing the temperature of the solder material below its melting point.

10. The assembly method of claim 9, wherein the majority of the concavity lies outside a perimeter of the first pattern of solder wettable material.

11. The assembly method of claim 9, further comprising a second pattern of solder wettable material disposed at the second mating surface of the thermal component.

12. The assembly method of claim 11, wherein the first pattern of solder wettable material corresponds with at least a portion of the second pattern of solder wettable material.

13. The assembly method of claim 9, wherein the bond line gap is maintained during assembly by at least three bond line spacers, at least one of which is provided at either the first or the second mating surface.

14. The assembly method of claim 9, wherein the solder material is selected from the group consisting of indium, an indium alloy, lead, a lead alloy, a silver alloy, a tin alloy, a copper alloy, a bismuth alloy, a gold alloy, a phase change polymer material, and a metallic, particle-filled solder material, or some combination thereof, and the solder wettable material is selected from the group consisting of gold, platinum, palladium, silver, tin, copper, and nickel, or some combination thereof.

15. The assembly method of claim 14, wherein the particles comprise at least one thermally conductive material different from the metallic solder material.

16. The assembly method of claim 9, wherein the thermal component is a thin die.

17. An microelectronic package, comprising:

a package substrate;

at least one semiconductor device coupled with the substrate;

a cooling device thermally coupled with the semiconductor device, the cooling device comprising;

a thermally conductive body having a first mating surface;

a solder wettable material disposed in a first pattern over at least a portion of the first mating surface;

a concavity formed into the first mating surface of the thermally conductive body, the concavity being configured to receive a reflowable solder material therein, the concavity further having a tapered depth that is shallower proximate to the first pattern of solder wettable material and

a solder joint thermally coupling a second mating surface on the semiconductor device with the first mating surface on the thermally conductive body, the solder joint substantially filling a gap between the first and second mating surfaces.

18. The package of claim 17, further comprising a computer motherboard electrically coupled with the package substrate.

19. The package of claim 17, wherein the semiconductor device is a thin die.

20. The package of claim 17, further comprising a solder wettable material disposed in a second pattern over a portion of the first mating surface.