Post passivation interconnection schemes on top of IC chip

• US 7,439,626 B2
• Filed: 09/17/2007
• Issued: 10/21/2008
• Est. Priority Date: 10/18/2000
• Status: Expired due to Term

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Megica Corporation (Chipbond Technology Corporation)
• Inventors: Lin, Mou-Shiung, Lee, Jin-Yuan
• Primary Examiner(s): Pham; Long
• Application Number:
  US11/856,075
• Publication Number:
  US 20080001294A1
• Time in Patent Office: 400 Days
• Field of Search: 257/773, 257/690, 257/700, 257/774
• US Class Current: 257/773
• CPC Class Codes: H01L 21/768 Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
• CPC Class Codes: H01L 21/76801 characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213
• CPC Class Codes: H01L 23/5222 Capacitive arrangements or effects of, or between wiring layers other capacitive arrangements H01L23/642
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/5283 Cross-sectional geometry
• CPC Class Codes: H01L 23/5286 Arrangements of power or ground buses
• CPC Class Codes: H01L 23/5329 Insulating materials
• CPC Class Codes: H01L 23/53295 Stacked insulating layers
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 23/62 Protection against overvoltage, e.g. fuses, shunts
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 27/0248 for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over the layer of dielectric, a thick second layer of dielectric is created over the surface of the layer of passivation. Thick and wide interconnect lines are created in the thick second layer of dielectric. The first layer of dielectric may also be eliminated, creating the wide thick interconnect network on the surface of the layer of passivation that has been deposited over the surface of a substrate.

Claims

1. A chip comprising:

a silicon substrate;

a first internal circuit in or on said silicon substrate;

a second internal circuit in or on said silicon substrate;

a third internal circuit in or on said silicon substrate;

a dielectric layer over said silicon substrate;

a first local ground distribution network over said silicon substrate and in said dielectric layer, wherein said first local ground distribution network is connected to said first internal circuit and to said second internal circuit, and wherein said first internal circuit is connected to said second internal circuit through said first local ground distribution network;

a second local ground distribution network over said silicon substrate and in said dielectric layer, wherein said second local ground distribution network is connected to said third internal circuit;

a passivation layer over said dielectric layer;

a first via in said passivation layer, wherein said first via is connected to said first local ground distribution network;

a second via in said passivation layer, wherein said second via is connected to said second local ground distribution network; and

a global ground distribution network over said passivation layer, wherein said global ground distribution network is connected to said first and second vias, and wherein said first and second internal circuits are connected to said third internal circuit through, in sequence, said first local ground distribution network, said first via, said global ground distribution network, said second via and said second local ground distribution network.

2. The chip of claim 1 further comprising a fourth internal circuit in or on said silicon substrate, wherein said first local ground distribution network is connected to said fourth internal circuit, wherein said first and second internal circuits are connected to said fourth internal circuit through said first local ground distribution network, and wherein said fourth internal circuit is connected to said third internal circuit through, in sequence, said first local ground distribution network, said first via, said global ground distribution network, said second via and said second local ground distribution network.

3. The chip of claim 1 further comprising a fourth internal circuit in or on said silicon substrate, a third local ground distribution network over said silicon substrate and in said dielectric layer, wherein said third local ground distribution network is connected to said fourth internal circuit, and a third via in said passivation layer, wherein said third via is connected to said third local ground distribution network and to said global ground distribution network, wherein said first and second internal circuits are connected to said fourth internal circuit through, in sequence, said first local ground distribution network, said first via, said global ground distribution network, said third via and said third local ground distribution network, and wherein said third internal circuit is connected to said fourth internal circuit through, in sequence, said second local ground distribution network, said second via, said global ground distribution network, said third via and said third local ground distribution network.

4. The chip of claim 1 further comprising an ESD circuit in or on said silicon substrate, wherein said ESD circuit is connected to said first, second and third internal circuits through said global ground distribution network.

5. The chip of claim 1 further comprising a polymer layer over said passivation layer, wherein said global ground distribution network is in said polymer layer.

6. The chip of claim 5, wherein said polymer layer has a thickness greater than 2 micrometers.

7. The chip of claim 1, wherein said global ground distribution network comprises an interconnecting line having a thickness greater than 1 micrometer.

8. The chip of claim 1, wherein said passivation layer comprises a topmost nitride layer of said chip.

9. The chip of claim 1, wherein said passivation layer comprises a nitride layer and an oxide layer.

10. A chip comprising:

a silicon substrate;

a first internal circuit in or on said silicon substrate;

a second internal circuit in or on said silicon substrate;

a third internal circuit in or on said silicon substrate;

a fourth internal circuit in or on said silicon substrate;

a dielectric layer over said silicon substrate;

a first local ground distribution network over said silicon substrate and in said dielectric layer, wherein said first local ground distribution network is connected to said first internal circuit and to said second internal circuit, and wherein said first internal circuit is connected to said second internal circuit through said first local ground distribution network;

a second local ground distribution network over said silicon substrate and in said dielectric layer, wherein said second local ground distribution network is connected to said third internal circuit and to said fourth internal circuit, and wherein said third internal circuit is connected to said fourth internal circuit through said second local ground distribution network;

a passivation layer over said dielectric layer, wherein said passivation layer comprises a topmost nitride layer of said chip;

a first via in said passivation layer, wherein said first via is connected to said first local ground distribution network;

a second via in said passivation layer, wherein said second via is connected to said second local ground distribution network; and

a global ground distribution network over said passivation layer, wherein said global ground distribution network is connected to said first and second vias, and wherein said first and second internal circuits are connected to said third and fourth internal circuits through, in sequence, said first local ground distribution network, said first via, said global ground distribution network, said second via and said second local ground distribution network.

11. The chip of claim 10 further comprising a fifth internal circuit in or on said silicon substrate, wherein said first local ground distribution network is connected to said fifth internal circuit, wherein said first and second internal circuits are connected to said fifth internal circuit through said first local ground distribution network, and wherein said fifth internal circuit is connected to said third and fourth internal circuits through, in sequence, said first local ground distribution network, said first via, said global ground distribution network, said second via and said second local ground distribution network.

12. The chip of claim 10 further comprising a fifth internal circuit in or on said silicon substrate, a third local ground distribution network over said silicon substrate and in said dielectric layer, wherein said third local ground distribution network is connected to said fifth internal circuit, and a third via in said passivation layer, wherein said third via is connected to said third local ground distribution network and to said global ground distribution network, wherein said first and second internal circuits are connected to said fifth internal circuit through, in sequence, said first local ground distribution network, said first via, said global ground distribution network, said third via and said third local ground distribution network, and wherein said third and fourth internal circuits are connected to said fifth internal circuit through, in sequence, said second local ground distribution network, said second via, said global ground distribution network, said third via and said third local ground distribution network.

13. The chip of claim 10 further comprising an ESD circuit in or on said silicon substrate, wherein said ESD circuit is connected to said first, second, third and fourth internal circuits through said global ground distribution network.

14. The chip of claim 10 further comprising a polymer layer over said passivation layer, wherein said global ground distribution network is in said polymer layer.

15. The chip of claim 14, wherein said polymer layer has a thickness greater than 2 micrometers.

16. The chip of claim 10, wherein said global ground distribution network comprises an interconnecting line having a thickness greater than 1 micrometer.