Thermal management apparatus and uses thereof
First Claim
Patent Images
1. A magnetic resonance imaging (MRI) device, comprising:
- a non-magnetic, thermally conductive spreader substrate comprising a broken metal layer coupled to a thermally conductive, electrically non-conductive layer, wherein the broken metal layer is configured to exchange heat with at least one serpentine cooling tube.
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Abstract
In one aspect, a magnetic resonance imaging (MRI) device includes a non-magnetic, thermally conductive spreader substrate having a broken metal layer coupled to a thermally conductive, electrically non-conductive layer, wherein the broken metal layer is configured to exchange heat with at least one serpentine cooling tube.
33 Citations
17 Claims
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1. A magnetic resonance imaging (MRI) device, comprising:
a non-magnetic, thermally conductive spreader substrate comprising a broken metal layer coupled to a thermally conductive, electrically non-conductive layer, wherein the broken metal layer is configured to exchange heat with at least one serpentine cooling tube. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A magnetic resonance imaging (MRI) device comprising:
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a main magnet; a non-magnetic spreader substrate comprising a thermally conductive surface; at least one serpentine cooling tube disposed on and in thermal contact with the thermally conductive surface, wherein the at least one serpentine cooling tube is configured to cool the thermally conductive surface; and a gradient coil comprising a cylindrical magnetic winding layer, wherein the cylindrical magnetic winding layer is configured in thermal contact with the non-magnetic spreader substrate to conduct heat from the cylindrical magnetic winding layer to the non-magnetic spreader substrate; wherein the non-magnetic spreader substrate comprises a metal layer bonded to a thermally conductive, electrically nonconductive layer, the metal layer is in thermal contact with the at least one serpentine cooling tube, and the cylindrical magnetic winding layer is in contact with the thermally conductive, electrically nonconductive layer. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification