Apparatus and method for testing conductive bumps
First Claim
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1. A bump testing unit for testing a plurality of conductive bumps comprising:
- a support substrate with at least two probes protruding from one surface thereof, for contacting the conductive bumps;
a digital testing device embedded in the support substrate, comprising a first and second input terminals and an output terminal, wherein the first input terminal is electrically connected to one of the probes; and
a first circuit formed in the support substrate to electrically connect a third input terminal of the digital testing device and the probe not connected with the first input terminal, for providing the digital testing device with a set signal or providing the probe not connected to the first input terminal with a test signal,wherein the digital testing device is a flip-flop.
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Abstract
An apparatus and method for testing conductive bumps are provided. An exemplary embodiment of a bump testing unit comprises a support substrate with two probes protruding one surface thereof. A digital detecting device is embedded in the support substrate, comprising a first and second input terminals and an output terminal, wherein the input terminals electrically connects one of the probes.
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17 Claims
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1. A bump testing unit for testing a plurality of conductive bumps comprising:
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a support substrate with at least two probes protruding from one surface thereof, for contacting the conductive bumps; a digital testing device embedded in the support substrate, comprising a first and second input terminals and an output terminal, wherein the first input terminal is electrically connected to one of the probes; and a first circuit formed in the support substrate to electrically connect a third input terminal of the digital testing device and the probe not connected with the first input terminal, for providing the digital testing device with a set signal or providing the probe not connected to the first input terminal with a test signal, wherein the digital testing device is a flip-flop. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An apparatus for instantaneously testing a plurality of conductive bumps, comprising:
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a support substrate formed with a plurality of probes protruding one surface thereof, for contacting the conductive bumps; and a plurality of digital testing devices embedded in the support substrate, each comprising a first and second input terminals and an output terminal, wherein each of the first input terminals is electrically connected to a separate probe among the plurality of probes and the output terminal of a previous digital testing device among the plurality of digital testing devices is connected to the second input terminal of a following digital testing device adjacent thereto among the plurality of digital testing devices; and a first circuit formed in the support substrate respectively connected to a third input terminal of each of the digital testing devices and electrically connected to the probes not connected with the first input terminal, for providing a set signal to each of the digital testing devices or providing a test signal with each of the probes not connected with the first input terminal. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification