Sequential unique marking
First Claim
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1. A method of culling semiconductor devices, comprising:
- retrieving a plurality of semiconductor devices from at least one reject bin;
providing at least one carrier having a plurality of pocket locations;
assigning an ID code to the at least one carrier;
placing each semiconductor device of the plurality of semiconductor devices in a pocket location of the plurality of pocket locations;
testing each semiconductor device of the plurality of semiconductor devices to develop corresponding test data;
generating a tray map comprising the ID code and the corresponding test data of each semiconductor device of the plurality of semiconductor devices; and
marking each semiconductor device of the plurality of semiconductor devices with a unique marking representing the corresponding test data.
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Abstract
The present invention comprises a method of sequential unique marking comprising providing a multi-die handling device with a plurality of semiconductor devices therein, reading an ID code on the multi-die handling device, retrieving a tray map file corresponding to the ID code, determining a tray matrix of the multi-die handling device, retrieving data from the tray map file, the data comprising unique characters correlating to each semiconductor device of the plurality of semiconductor devices, and marking each semiconductor device with the data.
49 Citations
14 Claims
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1. A method of culling semiconductor devices, comprising:
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retrieving a plurality of semiconductor devices from at least one reject bin; providing at least one carrier having a plurality of pocket locations; assigning an ID code to the at least one carrier; placing each semiconductor device of the plurality of semiconductor devices in a pocket location of the plurality of pocket locations; testing each semiconductor device of the plurality of semiconductor devices to develop corresponding test data; generating a tray map comprising the ID code and the corresponding test data of each semiconductor device of the plurality of semiconductor devices; and marking each semiconductor device of the plurality of semiconductor devices with a unique marking representing the corresponding test data. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of culling semiconductor devices, comprising:
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retrieving a plurality of semiconductor devices from at least one reject bin; providing a plurality of carriers, each carrier of the plurality having a plurality of pocket locations configured in a tray matrix; assigning an ID code to at least one carrier of the plurality of carriers; placing each semiconductor device of the plurality of semiconductor devices in a pocket location of the plurality of pocket locations; testing each semiconductor device of the plurality of semiconductor devices to develop corresponding test data; generating a tray map for each carrier of the plurality of carriers, the tray map comprising the ID code and the corresponding test data of each semiconductor device of the plurality of semiconductor devices; and marking each semiconductor device of the plurality of semiconductor devices with a unique marking representing the corresponding test data. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification