Light source module

• US 7,441,925 B2
• Filed: 12/14/2005
• Issued: 10/28/2008
• Est. Priority Date: 06/03/2005
• Status: Active Grant

• Current Assignee: AU Optronics Corporation
• Original Assignee: AU Optronics Corporation
• Inventors: Liu, Pang-Hsuan, Chou, Shen-Hong
• Primary Examiner(s): Lee; Y My Quach
• Application Number:
  US11/302,164
• Publication Number:
  US 20060274528A1
• Time in Patent Office: 1,049 Days
• Field of Search: 362/240, 362/247, 362/249, 362/294, 362/373, 362/800, 361/704, 361/717, 361/718, 361/719
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A method for assembling light emitting diode units and a substrate in a light source module and a structure thereof are provided. The light emitting diode unit is made of a light emitting diode and a carrier. Every light emitting diode has a flanged profile in the bottom to form a leaned plane, and a corresponding hole is formed on the substrate. Hence, when the light emitting diodes are pressed on the surface of a radiator by the substrate to make a closer contact, the light emitting diodes will be able to bear the pressure by the flanged design.

Claims

1. A light source module, comprising:

a substrate having a first through hole;

a light emitting diode unit having a carrier and a light emitting diode on the carrier;

a radiator connected to a bottom of the carrier and including a heat dissipation sheet; and

a thermal pad disposed between the carrier and the radiator,

wherein a diameter of a fixed portion of the carrier is larger than that of the first through hole so that when the carrier of the light emitting diode passes through the first through hole, the fixed portion leans against a first surface of the substrate, and wherein the light emitting diode is completely exposed on a surface of the substrate such that no light emitted from the light emitting diode is blocked along the surface of the substrate.

2. The light source module of claim 1, wherein the carrier includes a lead electrically connected to the light emitting diode, and wherein the carrier includes another portion other than the fixed portion, said another portion completely lying in the first through hole.

3. The light source module of claim 1, wherein the substrate is a printed circuit board.

4. The light source module of claim 1, further comprising a reflective sheet disposed on a second surface of the substrate.

5. The light source module of claim 4, wherein the reflective sheet has a second through hole corresponding to the first through hole so that the light emitting diode passes through the second through hole and extends from the reflective sheet.

6. The light source module of claim 5, wherein a diameter of the second through hole is equal to a diameter of the carrier such that a side of the carrier is invisible from atop the surface of the substrate.

7. A light source module, comprising:

a substrate having at least one through trench, a first surface and a second surface opposite to the first surface; and

a plurality of light emitting diode units corresponding to the through trench, wherein each of the plurality of light emitting diode units comprises a carrier and a light emitting diode on the carrier, the carrier has a fixed portion having a diameter larger than the width of the through trench, and the light emitting diode unit passes through the through trench from the first surface of the substrate and is exposed on the second surface so that the fixed portion leans against the surrounding area of the through trench on the first surface.

8. The light source module of claim 7, wherein the carrier includes a lead electrically connected to the light emitting diode.

9. The light source module of claim 8, wherein the lead is electrically connected to one or more conductive wires.

10. The light source module of claim 7, further comprising a radiator connected to a bottom of the carrier.

11. The light source module of claim 10, wherein the radiator has a heat dissipation sheet.

12. The light source module of claim 10, further comprising a thermal pad disposed between the carrier and the radiator.

13. The light source module of claim 7, further comprising a reflective sheet disposed on the second surface of the substrate.

14. The light source module of claim 13, wherein the reflective sheet having a plurality of through holes corresponding to the light emitting diode unit such that the plurality of light emitting diodes pass through the through holes and are exposed on the reflective sheet.

15. The light source module of claim 7, wherein the substrate is a printed circuit board.