Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials
First Claim
1. A method of forming a conductive element onto a substrate, comprising:
- selectively heating, at most, a portion of a fully exposed organometallic layer overlying at least a portion of a substrate; and
removing an unheated portion of the fully exposed organometallic layer.
7 Assignments
0 Petitions
Accused Products
Abstract
A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.
225 Citations
26 Claims
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1. A method of forming a conductive element onto a substrate, comprising:
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selectively heating, at most, a portion of a fully exposed organometallic layer overlying at least a portion of a substrate; and removing an unheated portion of the fully exposed organometallic layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a conductive via, comprising:
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forming a hole at least partially through a thickness of a substrate; depositing an organometallic material within at least a portion of the hole; and selectively heating at least a portion of the organometallic material. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of forming a conductive element onto a substrate, the method comprising:
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depositing a flowable, uncured conductive material onto a surface of a substrate; curing selected portions of a fully exposed flowable, uncured conductive material; removing a portion of the cured conductive material. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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Specification