Thermally improved placement of power-dissipating components onto a circuit board

• US 7,443,025 B2
• Filed: 06/07/2005
• Issued: 10/28/2008
• Est. Priority Date: 06/07/2004
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Verbist, Rudi
• Primary Examiner(s): Tran; Minh-Loan
• Assistant Examiner(s): LIU, BENJAMIN T
• Application Number:
  US11/146,234
• Publication Number:
  US 20050270749A1
• Time in Patent Office: 1,239 Days
• Field of Search: 257/685, 257/686, 257/777, 257/778, 257/E23.085, 257/E23.169, 257/E23.178, 257/706, 257/707, 257/713, 257/723, 257/724, 257/E23.051, 257/E23.081, 257/712, 361/704, 324/755
• US Class Current: 257/712
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2201/10477 Inverted
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention refers to an electronic system, comprising several power-dissipating components, and a circuit board, wherein said power-dissipating components are mounted both to a top side and a bottom side of said circuit board. Further, the invention refers to method for mounting power-dissipating components onto a circuit board, comprising the steps of (a) determining the thermal behavior of said power-dissipating components; and (b) determining, in accordance thereto, the placement of said power-dissipating components on both a top side and a bottom side of said circuit board.

Claims

1. An electronic system comprising:

a first group of power-dissipating components mounted to a top side of a circuit board; and

a second group of power-dissipating components mounted to a bottom side of said circuit board,

wherein said first group of power-dissipating components are arranged in a first group of rows or columns, wherein a first distance between neighboring rows or columns in said first group of rows or columns is determined in accordance with a thermal behavior of each of said first group of power-dissipating components,

wherein said second group of power-dissipating components are arranged in a second group of rows or columns, wherein a second distance between neighboring rows or columns in said second group of rows or columns is determined in accordance with a thermal behavior of each of said second group of power-dissipating components, and

wherein a third distance between said first group of rows or columns and said second group of rows or columns is determined in accordance with said thermal behavior of each of said first group of power-dissipating components and said thermal behavior of each of said second group of power-dissipating components.

2. The electronic system of claim 1, wherein at least one of said first group of power-dissipating components or at least one of said second group of power-dissipating components includes a package containing an electronic device.

3. The electronic system of claim 2, wherein said electronic device is an integrated circuit.

4. The electronic system of claim 1, wherein all of said first group of power-dissipating components and said second group of power-dissipating components show a similar thermal behavior.

5. The electronic system of claim 4, wherein power dissipated via a bottom of at least one of said first group of power-dissipating components or at least one of said second group of power-dissipating components is lower than power dissipated via a top of said at least one first group of power-dissipating components or said at least one of said second group of power-dissipating components.

6. The electronic system of claim 4, wherein power dissipated via the top of said at least one first group of power-dissipating components or said at least one of said second group of power-dissipating components is lower than power dissipated via the bottom of said at least one first group of power-dissipating components or said at least one of said second group of power-dissipating components.

7. The electronic system of claim 1, wherein said first group of power-dissipating components or said second group of power-dissipating components includes at least four power-dissipating components.

8. The electronic system of claim 1, wherein said first group of rows or columns are offset with respect to said second group of rows or columns.

9. A method for mounting power-dissipating components onto a circuit board, comprising:

(A) determining a thermal behavior of a first group of power-dissipating components;

(B) determining a first distance between neighboring rows or columns in a first group of rows or columns based upon said thermal behavior of said first group of power-dissipating components;

(C) determining a thermal behavior of a second group of power-dissipating components;

(D) determining a second distance between neighboring rows or columns in a second group of rows or columns based upon said thermal behavior of said second group of power-dissipating components;

(E) mounting said first group of power-dissipating components in said first group of rows or columns on a top side of a circuit board based upon said first distance and said second group of power-dissipating components in said second group of rows or columns on a bottom side of said circuit board based upon said second distance.

10. The method of claim 9, wherein at least one of said first group of power-dissipating components or at least one of said second group of power-dissipating components includes a package containing an electronic device.

11. The method of claim 10, wherein said electronic device is an integrated circuit.

12. The method of claim 9, wherein said step of determining of the thermal behavior of said power-dissipating components comprises:

determining power dissipated via the bottom of said power-dissipating components.

13. The method of claim 9, wherein step (A) comprises:

determining power dissipated via a top of each of said first group of power-dissipating components.

14. The method of claim 9, wherein step (E) comprises:

(E)(i) offsetting said first group of rows or columns mounted to said top side of said circuit board with respect to said second group of rows or columns mounted to said bottom side of said circuit board.

15. The method of claim 14, wherein step (E)(i) comprises:

offsetting said first group of rows or columns mounted to said top side of said circuit board with respect to said second group of rows or columns mounted to said bottom side of said circuit board based on said thermal behavior of said first group of power-dissipating components or said thermal behavior of said second group of power-dissipating components.