Packaging for an interferometric modulator
First Claim
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1. A display apparatus package, comprising:
- a transparent substrate;
a plurality of interferometric modulator arrays formed on a back side of the substrate;
a back plate;
a seal circumscribing each of said arrays and joining the back plate to the back side of the substrate to form a multiple sub-packages wherein each sub-package comprises one of said arrays; and
a desiccant inside the multiple sub-packages,wherein the transparent substrate comprises scribed lines between the multiple sub-packages.
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Abstract
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
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Citations
27 Claims
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1. A display apparatus package, comprising:
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a transparent substrate; a plurality of interferometric modulator arrays formed on a back side of the substrate; a back plate; a seal circumscribing each of said arrays and joining the back plate to the back side of the substrate to form a multiple sub-packages wherein each sub-package comprises one of said arrays; and a desiccant inside the multiple sub-packages, wherein the transparent substrate comprises scribed lines between the multiple sub-packages. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification