Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package

• US 7,443,647 B2
• Filed: 04/20/2005
• Issued: 10/28/2008
• Est. Priority Date: 04/08/1997
• Status: Expired due to Fees

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, Anthony A.
• Primary Examiner(s): Jackson; Stephen W
• Application Number:
  US11/109,665
• Publication Number:
  US 20070019352A1
• Time in Patent Office: 1,287 Days
• Field of Search: 361/118
• US Class Current: 361/118
• CPC Class Codes: H01C 7/12 Overvoltage protection resistors series resistors structurally associated with spark gaps H01T1/16
• CPC Class Codes: H01C 7/123 Arrangements for improving potential distribution
• CPC Class Codes: H01C 7/18 comprising a plurality of layers stacked between terminals
• CPC Class Codes: H01G 4/01 Form of self-supporting electrodes
• CPC Class Codes: H01G 4/012 Form of non-self-supporting electrodes
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters
• CPC Class Codes: H03H 2001/0014 Capacitor filters, i.e. capacitors whose parasitic inductance is of relevance to consider it as filter
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component'"'"'s architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.

Claims

1. An energy conditioner structure, comprising:

an A conductive structure;

a B conductive structure;

a G conductive structure;

wherein said A conductive structure, said B conductive structure, and said G conductive structure are conductively isolated from one another in said energy conditioner structure;

wherein said A conductive structure includes at least an A conductive structure first layer in a first plane, said A conductive structure first layer having an A conductive structure first layer first region and an A conductive structure first layer second region;

wherein said B conductive structure includes at least a B conductive structure first layer in said first plane;

wherein said B conductive structure includes at least a B conductive structure second layer in a second plane, said second plane different from said first plane, said B conductive structure second layer including a B conductive structure second layer first region and a B conductive structure second layer second region;

wherein said B conductive structure second layer first region and said A conductive structure first layer first region overlap one another and said B conductive structure second layer second region and said A conductive structure first layer second region do not overlap one another.

2. The structure of claim 1, wherein said G conductive structure includes a G conductive structure first layer, and said G conductive structure first layer is in a plane between said first plane and said second plane.

3. The structure of claim 1, wherein said A conductive structure includes at least an A conductive structure second layer in said second plane.

4. The structure of claim 3:

wherein said A conductive structure second layer has an A conductive structure second layer first region and an A conductive structure first layer second region;

wherein said B conductive structure first layer has a B conductive structure first layer first region and a B conductive structure first layer second region;

wherein said A conductive structure second layer first region and said B conductive structure first layer first region overlap one another and said A conductive structure second layer second region and said B conductive structure first layer second region do not overlap one another.

5. The structure of claim 1 wherein said G conductive structure includes at least a G conductive structure first layer in a third plane, a G conductive structure second layer in a fourth plan, and a G conductive structure third layer in a fifth plane;

wherein said third plane is above said first plane and said second plane,

wherein said fourth plane is between said first plane and said second plane; and

wherein said fifth plane is below said first plane and said second plane.

6. The structure of claim 1, wherein said G conductive structure includes a G conductive structure second layer, and said G conductive structure second layer is in said first plane.

7. The structure of claim 6, wherein said G conductive structure second layer is in a first plane central region of said first plane between said A conductive structure first layer and said B conductive structure first layer.

8. The structure of claim 2 wherein said G conductive structure first layer has a greater surface area than said A conductive structure first layer.

9. The structure of claim 2 wherein said A conductive structure first layer and said B conductive structure first layer have substantially the same surface area as one another.

10. A circuit comprising:

a source of electrical energy;

a load;

a load line energy pathway from said source to said load for transmission of electrical energy;

a return line energy pathway from said load to said source for transmission of electrical energy;

an energy conditioner structure;

wherein said energy conditioner structure comprises an A conductive structure, a B conductive structure, and a G conductive structure, and wherein said A conductive structure, said B conductive structure, and said G conductive structure are conductively isolated from one another in said energy conditioner structure;

wherein said A conductive structure is conductively connected to said load line and said B conductive structure is conductively connected to said return line.

11. The circuit of claim 10 further comprising a first conductive contact line and a second conductive contact line, wherein said first conductive contact line has a first end in physical contact with said A conductive structure and a second end in physical contact with said load line, and said second conductive contact line has a first end in physical contact with said B conductive structure and a second end in physical contact with said return line.

12. The circuit of claim 10 wherein said A conductive structure physically contacts said load line and said B conductive structure physically contacts said return line.

13. The circuit of claim 10 wherein said G conductive structure is not conductively connected to either said load line or said return line, and said G conductive structure shields said A conductive structure from said B conductive structure.

14. The circuit of claim 10 wherein said G conductive structure is conductively connected to said load line, and said G conductive structure shields said A conductive structure from said B conductive structure.

15. The circuit of claim 10 wherein said G conductive structure is conductively connected to said return line, and said G conductive structure shields said A conductive structure from said B conductive structure.

22. The circuit of claim 10, wherein said A conductive structure comprises an A first conductive layer, said B conductive structure comprises a B first conductive layer, and said A first conductive layer and said B first conductive layer reside in the same plane as one another.

23. The circuit of claim 22, wherein said B conductive structure comprises a B second conductive layer, and at least a portion of said B second conductive layer overlaps a portion of said A first conductive layer and is separated from said A first conductive layer by a portion of said G conductive structure.

16. A circuit comprising:

a source of electrical energy;

a load;

a load line energy pathway from said source to said load for transmission of electrical energy;

a return line energy pathway from said load to said source for transmission of electrical energy;

an energy conditioner structure;

wherein said energy conditioner structure comprises an A conductive structure, a B conductive structure, and a G conductive structure, wherein said A conductive structure, said B conductive structure, and said G conductive structure are conductively isolated from one another in said energy conditioner structure;

wherein said A conductive structure and said B conductive structure are conductively connected to said load line.

17. The circuit of claim 16 wherein said G conductive structure is conductively connected to said return line, and said G conductive structure shields said A conductive structure from said B conductive structure.

18. The circuit of claim 16 wherein said G conductive structure is not conductively connected to either said return line or said load line, and said G conductive structure shields said A conductive structure from said B conductive structure.

24. The circuit of claim 16, wherein said A conductive structure comprises an A first conductive layer, said B conductive structure comprises a B first conductive layer, and said A first conductive layer and said B first conductive layer reside in the same plane as one another.

25. The circuit of claim 24, wherein said B conductive structure comprises a B second conductive layer, and at least a portion of said B second conductive layer overlaps a portion of said A first conductive layer and is separated from said A first conductive layer by a portion of said G conductive structure.

19. A circuit comprising:

a source of electrical energy;

a load;

a load line energy pathway from said source to said load for transmission of electrical energy;

a return line energy pathway from said load to said source for transmission of electrical energy;

an energy conditioner structure;

wherein said energy conditioner structure comprises an A conductive structure, a B conductive structure, and a G conductive structure, wherein said A conductive structure, said B conductive structure, and said G conductive structure are conductively isolated from one another in said energy conditioner structure;

wherein said A conductive structure and said B conductive structure are conductively connected to said return line.

20. The circuit of claim 19 wherein said G conductive structure is conductively connected to said load line, and said G conductive structure shields said A conductive structure from said B conductive structure.

21. The circuit of claim 19 wherein said G conductive structure is not conductively connected to either said load line or said return line, and said G conductive structure shields said A conductive structure from said B conductive structure.