Flexible circuit board with heat sink

• US 7,443,678 B2
• Filed: 08/16/2006
• Issued: 10/28/2008
• Est. Priority Date: 08/18/2005
• Status: Expired due to Fees

• Current Assignee: Walsin Lihwa Corporation
• Original Assignee: Industrial Technology Research Institute
• Inventors: Tain, Ra-Min, Han, Wei-Kuo
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US11/464,870
• Publication Number:
  US 20070076381A1
• Time in Patent Office: 804 Days
• Field of Search: 361/704, 361/709, 361/710, 361/715, 361/717, 361719-722, 165/80.3, 165/80.4, 165/104.33, 165/185, 174/16.3, 174/252, 257718-722, 257/785, 385/14, 385/33, 385/35, 385/39, 385/49, 385/52, 385/88, 385/89, 385 92- 94, 385129-132, 298/900.3
• US Class Current: 361/704
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/777 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface which has a plurality of first grooves formed thereon. At least one platform is formed between two adjacent ones of the first grooves for mounting the at least one circuit substrate. The heat sink has a second lower surface and a second upper surface which has a plurality of second grooves formed thereon and is connected to the first lower surface.

Claims

1. A flexible substrate, comprising:

at least one circuit board having an insulation layer and at lease one conductive layer formed thereon, wherein the at least one conductive layer is patterned to form a circuit;

a heat spreader having a first upper surface and a first lower surface, wherein the first upper surface has a plurality of first grooves formed thereon;

at least one platform formed between two adjacent ones of the first grooves on the first upper surface of the heat spreader for mounting the at least one circuit board; and

a heat sink having a second upper surface and a second lower surface, wherein the second upper surface has a plurality of second grooves formed thereon and is connected to the first lower surface of the heat spreader.

2. The flexible substrate according to claim 1, wherein the plurality of first and the plurality of second grooves are the buffer areas when the flexible substrate is bent.

3. The flexible substrate according to claim 1, wherein the plurality of second grooves on the second upper surface have dispositions corresponding to those of the plurality of first grooves on the first upper surface.

4. The flexible substrate according to claim 1, wherein the insulation layer is formed by one of a resin material and a ceramic material.

5. The flexible substrate according to claim 1, wherein the conductive layer is formed by a metal material.

6. The flexible substrate according to claim 1, wherein the heat spreader is formed by the one selected from the group consisting of copper, aluminum, and graphite.

7. The flexible substrate according to claim 1, wherein the second lower surface further comprises a plurality of fins formed thereon.

8. A flexible optoelectronic device, comprising:

at least one circuit board having an LED package module formed thereon;

a heat spreader having a plurality of grooves formed thereon;

at least one platform formed between two adjacent ones of the plurality of grooves on the heat spreader for mounting the circuit board; and

a heat sink attached to the heat spreader for absorbing a heat from the heat spreader.

9. The flexible optoelectronic device according to claim 8, wherein the plurality of grooves are the buffer areas when the flexible optoelectronic device is bent.

10. The flexible optoelectronic device according to claim 8, wherein the LED package module has an irradiation direction which is adjustable by deforming widths of the grooves.

11. The flexible optoelectronic device according to claim 8, wherein the heat sink further comprises a plurality of fins.

12. The flexible optoelectronic device according to claim 8, wherein the at least one circuit board has a resin substrate.

13. The flexible optoelectronic device according to claim 8, wherein the heat aluminum, and graphite.

14. A flexible substrate, comprising:

a heat spreader having a plurality of first grooves formed thereon and at least one platform formed between two adjacent ones of the plurality of first grooves; and

a heat sink attached to the heat spreader, wherein the heat sink has a plurality of second grooves formed thereon and the plurality of second grooves have dispositions corresponding to those of the plurality of first grooves.

15. The flexible substrate according to claim 14, wherein the plurality of first and second grooves are the buffer areas when the flexible substrate is bent.

16. The flexible substrate according to claim 14, wherein at least one electronic device is disposed on the at least one platform.

17. The flexible substrate according to claim 14, wherein the heat spreader is formed by one selected from the group consisting of copper, aluminum, and graphite.