Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
First Claim
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1. An alignment precision enhancement method of an electronic component process on a flexible substrate comprising the steps of:
- placing said flexible substrate on a substrate holder;
completely sticking said flexible substrate to said substrate holder by covering said flexible substrate with a polymer tape and pressing said polymer tape and said flexible substrate towards said substrate holder with a press machine, thereby adhesively fixing said flexible substrate to said substrate holder by said polymer tape;
setting up a plural of alignment mark areas by removing said polymer tape within said alignment mark areas;
depositing or printing a metal or oxide layer on said polymer tape and also on said substrate holder within said alignment mark areas;
making an alignment mark within each of said alignment mark areas;
making an electronic component on said polymer tape located above said flexible substrate; and
separating said flexible substrate, said polymer tape, and said electronic component from said substrate holder by cutting said polymer tape with an unstressed cutting machine.
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Abstract
Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.
25 Citations
14 Claims
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1. An alignment precision enhancement method of an electronic component process on a flexible substrate comprising the steps of:
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placing said flexible substrate on a substrate holder; completely sticking said flexible substrate to said substrate holder by covering said flexible substrate with a polymer tape and pressing said polymer tape and said flexible substrate towards said substrate holder with a press machine, thereby adhesively fixing said flexible substrate to said substrate holder by said polymer tape; setting up a plural of alignment mark areas by removing said polymer tape within said alignment mark areas; depositing or printing a metal or oxide layer on said polymer tape and also on said substrate holder within said alignment mark areas; making an alignment mark within each of said alignment mark areas; making an electronic component on said polymer tape located above said flexible substrate; and separating said flexible substrate, said polymer tape, and said electronic component from said substrate holder by cutting said polymer tape with an unstressed cutting machine. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An alignment precision enhancement method of an electronic component process on a flexible substrate comprising the steps of:
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making a groove on a substrate holder and placing said flexible substrate in said groove; completely sticking said flexible substrate to said substrate holder by covering said flexible substrate with a polymer tape and pressing said polymer tape and said flexible substrate towards said substrate holder with a press machine, thereby adhesively fixing said flexible substrate to said substrate holder by said polymer tape; setting up a plural of alignment mark areas by removing said polymer tape within said alignment mark areas; depositing or printing a metal or oxide layer on said polymer tape and also on said substrate holder within said alignment mark areas; making an alignment mark within each of said alignment mark areas; making an electronic component on said polymer tape located above said flexible substrate; and separating said flexible substrate, said polymer tape, and said electronic component from said substrate holder by cutting said polymer tape with an unstressed cutting machine. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification