Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate
First Claim
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1. A method for constructing an antenna, the method comprising the steps of:
- providing a substrate having a first surface and a second surface, the first and second surfaces defining planes that are substantially parallel;
forming a conductive via stub in the substrate extending from the first surface to the second surface, wherein the conductive via stub is a radiating element of the antenna, the conductive via stub having a first diameter exposed at the first surface and a second diameter exposed at the second surface, the second diameter being greater than the first diameter; and
a ground plane disposed on the first surface having an opening surrounding the conductive via stub and a contact pad disposed on the conductive via stub within the opening.
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Abstract
Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
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Citations
10 Claims
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1. A method for constructing an antenna, the method comprising the steps of:
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providing a substrate having a first surface and a second surface, the first and second surfaces defining planes that are substantially parallel; forming a conductive via stub in the substrate extending from the first surface to the second surface, wherein the conductive via stub is a radiating element of the antenna, the conductive via stub having a first diameter exposed at the first surface and a second diameter exposed at the second surface, the second diameter being greater than the first diameter; and a ground plane disposed on the first surface having an opening surrounding the conductive via stub and a contact pad disposed on the conductive via stub within the opening. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for constructing an integrated communications apparatus, comprising the steps of:
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providing an antenna, the antenna comprising a substrate and a conductive via stub formed in the substrate, wherein the conductive via stub is a radiating element; forming an interposer device, wherein forming an interposer device comprises depositing an insulation layer over the substrate of the antenna having the ground plane; depositing a conductive layer over the insulation layer; patterning the conductive layer to form one or more contact pads, transmission lines, or both; forming a plurality of grounding vias in the insulation layer, the grounding vias being electrically connected to the ground plane; and forming a feeding via in the insulation layer, the feeding via being electrically connected to the conductive via stub; and connecting an IC (integrated circuit) chip to the antenna using the interposer device. - View Dependent Claims (8, 9, 10)
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Specification