Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

• US 7,444,734 B2
• Filed: 12/09/2003
• Issued: 11/04/2008
• Est. Priority Date: 12/09/2003
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Zwick, Thomas Martin, Gaucher, Brian Paul, Liu, Duixian, Pfeiffer, Ullrich Richard Rudolf
• Primary Examiner(s): Owens; Douglas W.
• Assistant Examiner(s): Alemu; Ephrem
• Application Number:
  US10/731,520
• Publication Number:
  US 20050122265A1
• Time in Patent Office: 1,792 Days
• Field of Search: 343/700.MS, 343/853, 343/846, 343/767, 296/00, 296/01, 257777-786
• US Class Current: 29/600
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/28 Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00
• CPC Class Codes: H01Q 9/40 Element having extended radiating surface
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Claims

1. A method for constructing an antenna, the method comprising the steps of:

providing a substrate having a first surface and a second surface, the first and second surfaces defining planes that are substantially parallel;

forming a conductive via stub in the substrate extending from the first surface to the second surface, wherein the conductive via stub is a radiating element of the antenna, the conductive via stub having a first diameter exposed at the first surface and a second diameter exposed at the second surface, the second diameter being greater than the first diameter; and

a ground plane disposed on the first surface having an opening surrounding the conductive via stub and a contact pad disposed on the conductive via stub within the opening.

2. The method of claim 1, further comprising:

depositing a second conductive layer on the second surface of the substrate; and

patterning the second conductive layer to form a hat element that is electrically connected to an end portion of the conductive via stub.

3. The method of claim of claim 1, further comprising:

depositing an insulation layer over the patterned first conductive layer;

depositing a third conductive layer over the insulation layer; and

patterning the third conductive layer to form one or more contact pads, transmission lines, or both.

4. The method of claim 3, further comprising forming a plurality of grounding vias in the insulation layer, the grounding vias being electrically connected to the ground plane.

5. The method of claim 4, further comprising forming a solder ball on each grounding via and on one or more contact pads or transmission lines of the patterned third conductive layer.

6. The method of claim 5, further comprising bonding the antenna to an IC chip using one or more of the solder balls.

7. A method for constructing an integrated communications apparatus, comprising the steps of:

providing an antenna, the antenna comprising a substrate and a conductive via stub formed in the substrate, wherein the conductive via stub is a radiating element;

forming an interposer device, wherein forming an interposer device comprises depositing an insulation layer over the substrate of the antenna having the ground plane;

depositing a conductive layer over the insulation layer;

patterning the conductive layer to form one or more contact pads, transmission lines, or both;

forming a plurality of grounding vias in the insulation layer, the grounding vias being electrically connected to the ground plane; and

forming a feeding via in the insulation layer, the feeding via being electrically connected to the conductive via stub; and

connecting an IC (integrated circuit) chip to the antenna using the interposer device.

8. The method of claim 7, wherein the antenna further comprises a ground plane formed on a surface of the substrate.

9. The method of claim 7, further comprising forming a solder ball on each grounding via and on one or more contact pads or transmission lines of the patterned third conductive layer.

10. The method of claim 9, wherein the step of connecting an IC chip to the antenna using the interposer device comprises bonding the antenna to the IC chip using one or more of the solder balls.