Sensor module and method of manufacturing same

• US 7,445,959 B2
• Filed: 08/25/2006
• Issued: 11/04/2008
• Est. Priority Date: 08/25/2006
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Theuss, Horst
• Primary Examiner(s): Pham; Thanh V
• Application Number:
  US11/467,474
• Publication Number:
  US 20080128838A1
• Time in Patent Office: 802 Days
• Field of Search: 438/15, 438/25, 438/26, 438/51, 438/64, 438/106, 438/107, 438/108, 257/778, 257/E21.318, 257/E21.499, 257/E21.503, 257/E21.511
• US Class Current: 438/108
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/81005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

The embodiments herein relate to sensor modules having sensor chips with a sensing region on a face thereof, and methods for their manufacture.

Claims

1. A method, comprising:

placing a sensor chip onto a carrier with a sensing region of the sensor facing the carrier;

applying a first material to the sensor chip adjacent the sensing region; and

removing said carrier from said sensing region.

2. The method according to claim 1, also including providing electronic circuitry and the sensing region on the sensor chip.

3. The method according to claim 1, wherein the carrier is formed of a second material.

4. The method according to claim 1, wherein placing the sensor chip onto the carrier includes attaching a face of the sensor to the carrier with sealing material.

5. The method according to claim 4, wherein the sealing material is applied selectively to portions of at least one of the carrier and the sensor.

6. The method according to claim 4, wherein the sealing material forms a closed barrier ridge that substantially encircles the sensing region.

7. The method according to claim 4, wherein said sealing material is electrically conducting.

8. The method according to claim 4, wherein the face of the sensor is comprised of multiple connection pads.

9. The method according to claim 1, wherein placing the sensor chip onto the carrier includes including forming a first protruding structure on the carrier to support the sensor chip.

10. The method according to claim 9, wherein the first protruding structure is formed of the same material as the carrier.

11. The method according to claim 9, wherein forming the first protruding structure includes forming a baffler ridge around the sensing region to shield said sensing region before removal of the carrier from the sensor chip.

12. The method according to claim 9, wherein placing the sensor chip on the carrier also includes placing the sensor chip on the first protruding structure.

13. The method according to claim 9, wherein forming the first protruding structure is at least one process selected from the group consisting of a first electroplating plating process, a first galvanic process, a first photolithographic process, a first stamping process, and a taping process.

14. The method according to claim 9, also including forming a second protruding structure on the carrier to support the sensor chip.

15. The method according to claim 9 wherein said second protruding structure is formed of a material that is different from the material of the first protruding structure.

16. The method according to claim 9, wherein said second protruding structure is structured to provide an electrical contact to at least one connection pad of said sensor.

17. The method according to claim 9, wherein placing the sensor chip onto the carrier also includes attaching the sensor chip to the carrier by applying conducting sealing material to at least one of the first protruding structure and the second protruding structure.

18. A method, comprising:

supporting a sensor chip by a carrier with a sensing region of the sensor facing the carrier;

applying a first material to the sensor chip adjacent the sensing region; and

at least partially removing said carrier from said sensing region.

19. The method of claim 18 and further comprising:

forming a plurality of protruding structures on the carrier, wherein the protruding structures comprise a conductive scaling material, wherein the protruding structures are positioned between the sensor chip and the carrier to support the sensor chip.

20. A method, comprising:

placing multiple sensor chips onto a carrier with a sensing region of each sensor facing the carrier; and

applying a first material to cover the sensor chips and areas between the sensor chips on the carrier;

removing at least a portion of the carrier to expose at least one sensing region.

21. The method of claim 20 and further comprising separating the sensor chips to form at least one individual sensor modules.

22. The method of claim 20 and further comprising providing a conductive sealing material to at least one sensing region and at least one electrical contact of a sensor prior to placing the sensor chips onto the carrier and applying the first material to cover the sensor chips.