Cooling apparatus and testing machine using the same

• US 7,446,547 B2
• Filed: 04/27/2006
• Issued: 11/04/2008
• Est. Priority Date: 08/17/2005
• Status: Expired due to Fees

• Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: Liao, Qing-Ming
• Primary Examiner(s): Hollington; Jermele M
• Application Number:
  US11/308,737
• Publication Number:
  US 20070052434A1
• Time in Patent Office: 922 Days
• Field of Search: None
• US Class Current: 324/750.01
• CPC Class Codes: G01R 31/2817 Environmental-, stress-, or burn-in tests of IC's G01R31/2855; of individual semiconductors G01R31/2642; of other circuits G01R31/2849

Abstract

A cooling apparatus includes a cooling device, a baseplate and at least one shock absorber. The cooling device is used for absorbing and dissipating heat. The shock absorber comprises a pole and a resilient member. The pole passes through the resilient member. The resilient member is clamped between the cooling device and the baseplate. The cooling device comprises a heatsink, and a fan such that the heatsink is supported by the fan. The heatsink defines a first guide hole therein. The fan defines a second guide hole therein. One end of the pole is connected to the baseplate, and the other end of the pole passes through the second guide hole of the fan and can slide within the first guide hole of the heatsink. A testing machine, using the cooling apparatus, for testing an electronic product is also disclosed.

Claims

1. A cooling apparatus comprising:

a cooling device for absorbing and dissipating heat;

a baseplate; and

at least one resilient shock absorber;

wherein the resilient shock absorber comprises a pole and a resilient member, the pole passes through the resilient member, the resilient member is clamped between the cooling device and the baseplate;

the cooling device comprises a heatsink, and a fan such that the heatsink is supported by the fan;

the heatsink defines a first guide hole therein, the fan defines a second guide hole therein;

one end of the pole is connected to the baseplate, and the other end of the pole passes through the second guide hole of the fan and can slide within the first guide hole of the heatsink.

2. The cooling apparatus according to claim 1, wherein the baseplate defines a third guide hole therein, an end of the pole is connected to the cooling device, and another end of the pole is slidably passed through the third guide hole of the baseplate.

3. The cooling apparatus according to claim 1, wherein the cooling device defines at least one guide hole therein, an end of the pole is connected to the baseplate, and another end of the pole can slide in the guide hole of the cooling device.

4. A testing machine for testing an electronic product, the testing machine comprising:

a carrier for supporting the electronic product;

a cooling apparatus being received in the carrier, and the cooling apparatus comprising;

a cooling device for contacting the electronic product to absorb and dissipate heat;

a baseplate being connected to the carrier; and

at least one shock absorber resiliently supporting the cooling device on the baseplate;

wherein the shock absorber comprises a pole and a resilient member, the pole passes through the resilient member, the resilient member is clamped between the cooling device and the baseplate;

the cooling device comprises a heatsink, and a fan supporting the heatsink;

the heatsink defines a first guide hole therein, the fan defines a second guide hole therein;

one end of the pole is fixed to the baseplate, and the other end of the pole passes through the second guide hole of the fan and can slide within the first guide hole of the heatsink.

5. The testing machine according to claim 4, wherein the carrier comprises a frame, a mounting board being on the frame, and at least one connecting shaft, wherein the cooling apparatus is received in the frame, and one end of the connecting shaft is connected to the mounting board while the other end of the connecting shaft is connected to the baseplate.

6. The testing machine according to claim 5, wherein the mounting board defines an opening therein, and a part of the cooling device protrudes from the opening.

7. A testing machine for testing an electronic product, the testing machine comprising:

a carrier supporting the electronic product;

a testing member configured for covering the electronic product;

a cooling apparatus being received in the carrier, and the cooling apparatus comprising;

a cooling device for contacting the electronic product to absorb and dissipate heat;

a baseplate being connected to the carrier; and

at least one shock absorber resiliently supporting the cooling device on the baseplate;

wherein the shock absorber comprises a pole and a resilient member, the pole passes through the resilient member, the resilient member is clamped between the cooling device and the baseplate;

the cooling device comprises a heatsink, and a fan such that the heatsink is supported by the fan;

the heatsink defines a first guide hole therein, the fan defines a second guide hole therein;

an end of the pole is connected to the baseplate, and another end of the pole passes through the second guide hole of the fan and can slide within the first guide hole of the heatsink.

8. The testing machine according to claim 7, wherein the carrier comprises a frame, a mounting board being on the frame, and at least one connecting shaft, wherein the cooling apparatus is received in the frame, and one end of the connecting shaft is connected to the mounting board while the other end of the connecting shaft is connected to the baseplate.

9. The testing machine according to claim 8, wherein the mounting board defines an opening therein, and a part of the cooling device protrudes from the opening.