Temperature measurement system having a plurality of microelectromechanical resonators and method of operating same
First Claim
1. A temperature measurement system, comprising:
- a first microelectromechanical resonator to generate a first output signal having a frequency that varies with operating temperature, wherein the first microelectromechanical resonator includes a frequency function of temperature;
a second microelectromechanical resonator to generate a second output signal having a frequency that varies with operating temperature, wherein the second microelectromechanical resonator includes a frequency function of temperature; and
frequency division circuitry, coupled to the first and second microelectromechanical resonators, to determine data which is representative of the operating temperature of the first and/or second microelectromechanical resonator using (i) data which is representative of the frequency of the first output signal and (ii) data which is representative of the frequency of the second output signal.
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Accused Products
Abstract
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to a temperature measurement system comprising (1) a first microelectromechanical resonator to generate a first output signal having a frequency that varies with operating temperature, wherein the first microelectromechanical resonator includes a frequency function of temperature; (2) a second microelectromechanical resonator to generate a second output signal having a frequency that varies with operating temperature, wherein the second microelectromechanical resonator includes a frequency function of temperature; and (3) frequency division circuitry, coupled to the first and second microelectromechanical resonators, to determine data which is representative of the operating temperature of the first and/or second microelectromechanical resonator using (i) data which is representative of the frequency of the first output signal and (ii) data which is representative of the frequency of the second output signal. The frequency division circuitry may include circuitry to divide the frequency of the first output signal by the frequency of the second output signal (whether in digital or analog domain).
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Citations
25 Claims
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1. A temperature measurement system, comprising:
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a first microelectromechanical resonator to generate a first output signal having a frequency that varies with operating temperature, wherein the first microelectromechanical resonator includes a frequency function of temperature; a second microelectromechanical resonator to generate a second output signal having a frequency that varies with operating temperature, wherein the second microelectromechanical resonator includes a frequency function of temperature; and frequency division circuitry, coupled to the first and second microelectromechanical resonators, to determine data which is representative of the operating temperature of the first and/or second microelectromechanical resonator using (i) data which is representative of the frequency of the first output signal and (ii) data which is representative of the frequency of the second output signal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A temperature measurement system, comprising:
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a first microelectromechanical resonator to generate a first output signal having a frequency that varies with operating temperature, wherein the first microelectromechanical resonator includes a frequency function of temperature; a second microelectromechanical resonator to generate a second output signal having a frequency that varies with operating temperature, wherein the second microelectromechanical resonator includes a frequency function of temperature; frequency division circuitry, coupled to the first and second microelectromechanical resonators, wherein the frequency division circuitry includes; circuitry to generate; data which is representative of the frequency of the first output signal; and data which is representative of the frequency of the second output signal; and analysis circuitry to determine data which is representative of the operating temperature of the first and/or second microelectromechanical resonators by dividing (i) the data which is representative of the frequency of the first output signal by (ii) the data which is representative of the frequency of the second output signal; and processor circuitry, coupled to the frequency division circuitry, to determine the operating temperature of the first and/or second microelectromechanical resonator using the data which is representative of the operating temperature of the first and/or second microelectromechanical resonators. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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21. A temperature measurement system, comprising:
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a first microelectromechanical resonator to generate a first output signal having a frequency that varies with operating temperature, wherein the first microelectromechanical resonator includes a frequency function of temperature; a second microelectromechanical resonator to generate a second output signal having a frequency that varies with operating temperature, wherein the second microelectromechanical resonator includes a frequency function of temperature; frequency division circuitry, coupled to the first and second microelectromechanical resonators, wherein the frequency division circuitry includes; circuitry to generate; data which is representative of the frequency of the first output signal; and data which is representative of the frequency of the second output signal; and analysis circuitry to determine data which is representative of the operating temperature of the first and/or second microelectromechanical resonators by dividing (i) the data which is representative of the frequency of the first output signal by (ii) the data which is representative of the frequency of the second output signal; processor circuitry, coupled to the frequency division circuitry, to determine the operating temperature of the first and/or second microelectromechanical resonator using the data which is representative of the operating temperature of the first and/or second microelectromechanical resonators; and wherein the first and second microelectromechanical resonators are disposed on and/or in the same substrate and the frequency division circuitry and the processor circuitry are disposed on or in the same substrate. - View Dependent Claims (22, 23, 24, 25)
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Specification