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Vapor chamber for dissipation heat generated by electronic component

  • US 7,447,029 B2
  • Filed: 03/14/2006
  • Issued: 11/04/2008
  • Est. Priority Date: 03/14/2006
  • Status: Expired due to Fees
First Claim
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1. A vapor chamber comprising:

  • a container having a base for contacting a heat-generating component, the container comprising a block located therein, the block thermally connecting the base and a cover of the container;

    a porous capillary enclosure contained within the container, the enclosure comprising a through hole defined therethough for accommodating the block; and

    a liquid contained in the container, wherein the porous capillary enclosure keeps an inner surface of the container and an outer surface of the block wet; and

    wherein an opening is defined through the cover and the block is received in the through hole of the enclosure and the opening of the cover, and wherein an upper surface of the block and an upper surface of the container are positioned in a same plane.

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