Single chip USB packages by various assembly methods
First Claim
1. A USB assembly adapted to be accessed by a data terminal, said USB assembly comprising:
- a modular USB core component comprising;
a PCBA including;
a card body,a non-volatile memory device mounted on the card body,a card reader interface circuit mounted on said card body, anda processing unit mounted on said card body and connected to said non-volatile memory device and said card reader interface circuit,wherein said card body comprises a printed circuit board (PCB) having opposing first and second surfaces, a plurality of metal contacts disposed on the first surface, at least one passive component mounted on the second surface,wherein at least one of the non-volatile memory device, the card reader interface circuit and the processing unit comprises an unpackaged integrated circuit (IC) die mounted on the second surface of the PCB, andwherein a plurality of conductive traces are formed on the PCB such that each conductive trace is electrically connected to at least one of an associated metal contact, the IC die and the passive component; and
a single-piece molded housing formed on the second surface of the PCBA such that said at least one passive component and said at least one IC die are covered by said molded housing, and such that substantially all of the first surface of the PCB is exposed; and
a case fixedly connected to the modular USB core component such that the metal contacts are exposed through one or more openings defined by said case.
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Accused Products
Abstract
A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.
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Citations
20 Claims
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1. A USB assembly adapted to be accessed by a data terminal, said USB assembly comprising:
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a modular USB core component comprising; a PCBA including; a card body, a non-volatile memory device mounted on the card body, a card reader interface circuit mounted on said card body, and a processing unit mounted on said card body and connected to said non-volatile memory device and said card reader interface circuit, wherein said card body comprises a printed circuit board (PCB) having opposing first and second surfaces, a plurality of metal contacts disposed on the first surface, at least one passive component mounted on the second surface, wherein at least one of the non-volatile memory device, the card reader interface circuit and the processing unit comprises an unpackaged integrated circuit (IC) die mounted on the second surface of the PCB, and wherein a plurality of conductive traces are formed on the PCB such that each conductive trace is electrically connected to at least one of an associated metal contact, the IC die and the passive component; and a single-piece molded housing formed on the second surface of the PCBA such that said at least one passive component and said at least one IC die are covered by said molded housing, and such that substantially all of the first surface of the PCB is exposed; and a case fixedly connected to the modular USB core component such that the metal contacts are exposed through one or more openings defined by said case. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for producing an USB assembly comprising:
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producing a modular USB core component including; a PCBA including; a cardbody, a non-volatile memory device mounted on the card body, a card reader interface circuit mounted on said card body, and a processing unit mounted on said card body and connected to said non-volatile memory device and said card reader interface circuit, wherein said card body comprises a printed circuit board (PCB) having opposing first and second surfaces, a plurality of metal contacts disposed on the first surface, at least one passive component mounted on the second surface, wherein at least one of the non-volatile memory device, the card reader interface circuit and the processing unit comprises an unpackaged integrated circuit (IC) die mounted on the second surface of the PCB handle section, and wherein a plurality of conductive traces are formed on the PCB such that each conductive trace is electrically connected to at least one of an associated metal contact, the IC die and the passive component; and a single-piece molded housing formed on the second surface of the PCBA such that said at least one passive component and said at least one IC die are covered by said molded housing, and such that substantially all of the first surface of the PCB is exposed; and mounting said modular USB core component into a case such that the case is fixedly connected to the modular USB core component with the metal contacts exposed through one or more openings defined by said case.
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Specification