On chip transformer isolator
First Claim
Patent Images
1. An integrated circuit having voltage isolation capabilities, comprising:
- a first area of the integrated circuit containing functional circuitry, the functional circuitry located in a substrate of the integrated circuit; and
a second area of the integrated circuit containing integrated RF isolation circuitry for voltage isolating the functional circuitry, the RF isolation circuitry located in metal layers of the integrated circuit wherein the RF isolation circuitry further comprises;
a first coil located on a first metal layer, the first coil connected to the functional circuitry;
a second coil located on a second metal layer above the first metal layer and substantially non-overlapping the first coil, the second coil electromagnetically coupled to the first coil; and
wherein runs of the first coil are diagonally offset from runs of the second coil.
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Abstract
An integrated circuit having voltage isolation capabilities includes a first area of the integrated circuit containing functional circuitry that is located in the substrate of the integrated circuit. A second area of the integrated circuit contains an integrated RF isolation circuitry for voltage isolating the functional circuitry. The RF isolation circuitry is located in the metal layers of the integrated circuit.
227 Citations
21 Claims
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1. An integrated circuit having voltage isolation capabilities, comprising:
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a first area of the integrated circuit containing functional circuitry, the functional circuitry located in a substrate of the integrated circuit; and a second area of the integrated circuit containing integrated RF isolation circuitry for voltage isolating the functional circuitry, the RF isolation circuitry located in metal layers of the integrated circuit wherein the RF isolation circuitry further comprises; a first coil located on a first metal layer, the first coil connected to the functional circuitry; a second coil located on a second metal layer above the first metal layer and substantially non-overlapping the first coil, the second coil electromagnetically coupled to the first coil; and wherein runs of the first coil are diagonally offset from runs of the second coil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit having voltage isolation capabilities, comprising:
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a first area of the integrated circuit containing functional circuitry, the functional circuitry located in a substrate of the integrated circuit; and a second area of the integrated circuit containing integrated at least one RF isolation interface for voltage isolating the functional circuitry, the at least one RF isolation interface located in metal layers of the integrated circuit above the substrate, the at least one RF isolation interface comprising; a first coil located on a first metal layer, the first coil connected to the functional circuitry; a second coil located on a second metal layer above the first metal layer and substantially non-overlapping the first coil, the second coil electromagnetically coupled to the first coil; wherein runs of the first coil are diagonally offset from runs of the second coil; first and second terminals located on a third metal layer below the first metal layer for interconnecting the first coil with the functional circuitry; a first pad connected to a first end of the second coil and located within the second coil; and a second pad connected to a second end of the second coil and located substantially near an edge of the second coil. - View Dependent Claims (10, 11, 12)
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13. An integrated circuit having voltage isolation capabilities, comprising:
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a first area of the integrated circuit containing a first group of functional circuitry, the first group of functional circuitry located in a substrate of the integrated circuit; a second area of the integrated circuit containing a second group of functional circuitry, the second group of functional circuitry located in the substrate of the integrated circuit; a third area of the integrated circuit containing integrated RF isolation circuitry for voltage isolating the first group of functional circuitry from the second group of functional circuitry , the RF isolation circuitry located in metal layers of the integrated circuit; and wherein the RF isolation circuitry further comprises; a first coil located on a first metal layer, the first coil connected to the first group of functional circuitry; a second coil located on a second metal layer above the first metal layer and substantially non-overlapping the first coil, the second coil electromagnetically coupled to the first coil a third coil located on the first metal layer, the third coil connected to the second group of functional circuitry; and a fourth coil located on the second metal layer above the first metal layer and substantially non-overlapping the third coil, the fourth coil electromagnetically coupled to the third coil and connected to the second coil. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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Specification