Connection for flex circuit and rigid circuit board
First Claim
1. An interconnection between circuits, the interconnection comprising:
- a first circuit defining a first surface and a second surface, the first circuit having at least one conductive pad, a relief vent formed through the first circuit conductive pad extending between the first and second surfaces of the first circuit;
a spacer defining first and second surfaces, the spacer having at least one aperture alignable to the relief vent of the first circuit;
a second circuit defining a first surface and a second surface, the second circuit having at least one conductive pad, a relief vent formed through the second circuit conductive pad extending between the first and second surfaces of the second circuit, the relief vent of the second circuit being alignable to the aperture of the spacer;
solder paste disposed within the aperture of the spacer and between the first and second circuits, the solder paste disposed within the relief vents of the first and second circuits;
wherein the first circuit is a flex circuit and the second circuit is a rigid circuit board.
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Accused Products
Abstract
Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.
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Citations
23 Claims
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1. An interconnection between circuits, the interconnection comprising:
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a first circuit defining a first surface and a second surface, the first circuit having at least one conductive pad, a relief vent formed through the first circuit conductive pad extending between the first and second surfaces of the first circuit; a spacer defining first and second surfaces, the spacer having at least one aperture alignable to the relief vent of the first circuit; a second circuit defining a first surface and a second surface, the second circuit having at least one conductive pad, a relief vent formed through the second circuit conductive pad extending between the first and second surfaces of the second circuit, the relief vent of the second circuit being alignable to the aperture of the spacer; solder paste disposed within the aperture of the spacer and between the first and second circuits, the solder paste disposed within the relief vents of the first and second circuits; wherein the first circuit is a flex circuit and the second circuit is a rigid circuit board.
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2. An interconnection between circuits, the interconnection comprising:
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a first circuit defining a first surface and a second surface, the first circuit having at least one conductive pad, a relief vent formed through the first circuit conductive pad extending between the first and second surfaces of the first circuit; a spacer defining first and second surfaces, the spacer having at least one aperture alignable to the relief vent of the first circuit; a second circuit defining a first surface and a second surface, the second circuit having at least one conductive pad, a relief vent formed through the second circuit conductive pad extending between the first and second surfaces of the second circuit, the relief vent of the second circuit being alignable to the aperture of the spacer; solder paste disposed within the aperture of the spacer and between the first and second circuits, the solder paste disposed within the relief vents of the first and second circuits; wherein the first and second circuits are flex circuits. - View Dependent Claims (3, 4, 5, 6, 7)
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8. An interconnection between circuits, the interconnection comprising:
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a first circuit defining a first surface and a second surface, the first circuit having at least one conductive pad; a second circuit defining a first surface and a second surface, the second circuit having at least one conductive pad, a relief vent formed through the second circuit conductive pad extending between the first and second surfaces of the second circuit; a spacer defining first and second surfaces, the spacer having at least one aperture aligned to the relief vent of the second circuit; solder paste disposed within the aperture of the spacer and between the first and second circuits, the solder paste disposed within the relief vent of the second circuit; wherein the first circuit is a flex circuit and the second circuit is a rigid circuit board.
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9. An interconnection between circuits, the interconnection comprising:
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a first circuit defining a first surface and a second surface, the first circuit having at least one conductive pad; a second circuit defining a first surface and a second surface, the second circuit having at least one conductive pad, a relief vent formed through the second circuit conductive pad extending between the first and second surfaces of the second circuit; a spacer defining first and second surfaces, the spacer having at least one aperture aligned to the relief vent of the second circuit; solder paste disposed within the aperture of the spacer and between the first and second circuits, the solder paste disposed within the relief vent of the second circuit; wherein the first and second circuits are flex circuits. - View Dependent Claims (10, 11, 12)
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13. An interconnection between circuits, the interconnection comprising:
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a lower circuit defining a lower surface and an upper surface, the lower circuit having at least one conductive pad; an upper circuit defining a lower surface and an upper surface, the upper circuit having at least one conductive pad, a relief vent formed through the upper circuit conductive pad extending between the upper and lower surfaces of the upper circuit; a spacer defining upper and lower surfaces, the spacer having at least one aperture aligned to the relief vent of the upper circuit; solder paste disposed within the aperture of the spacer and between the upper and lower circuits, the solder paste disposed within the relief vent of the upper circuit; wherein the upper circuit is a flex circuit and the lower circuit is a rigid circuit board.
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14. An interconnection between circuits, the interconnection comprising:
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a lower circuit defining a lower surface and an upper surface, the lower circuit having at least one conductive pad; an upper circuit defining a lower surface and an upper surface, the upper circuit having at least one conductive pad, a relief vent formed through the upper circuit conductive pad extending between the upper and lower surfaces of the upper circuit; a spacer defining upper and lower surfaces, the spacer having at least one aperture aligned to the relief vent of the upper circuit; solder paste disposed within the aperture of the spacer and between the upper and lower circuits, the solder paste disposed within the relief vent of the upper circuit; wherein the upper and lower circuits are flex circuits. - View Dependent Claims (15, 16, 17)
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18. An interconnection between circuits, the interconnection comprising:
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a first circuit defining a first surface and a second surface, the first circuit having at least one conductive pad, a relief vent formed through the first circuit conductive pad extending between the first and second surfaces of the first circuit; a spacer defining first and second surfaces, the spacer having at least one aperture alignable to the relief vent of the first circuit; a second circuit defining a first surface and a second surface, the second circuit having at least one conductive pad, a relief vent formed through the second circuit conductive pad extending between the first and second surfaces of the second circuit, the relief vent of the second circuit being alignable to the aperture of the spacer; solder paste disposed within the aperture of the spacer and between the first and second circuits, the solder paste disposed within the relief vents of the first and second circuits; wherein only the solder paste is disposed within the relief vents.
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19. An interconnection between circuits, the interconnection comprising:
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a first circuit defining a first surface and a second surface, the first circuit having at least one conductive pad, a relief vent formed through the first circuit conductive pad extending between the first and second surfaces of the first circuit; a spacer defining first and second surfaces, the spacer having at least one aperture alignable to the relief vent of the first circuit; a second circuit defining a first surface and a second surface, the second circuit having at least one conductive pad, a relief vent formed through the second circuit conductive pad extending between the first and second surfaces of the second circuit, the relief vent of the second circuit being alignable to the aperture of the spacer; solder paste disposed within the aperture of the spacer and between the first and second circuits, the solder paste disposed within the relief vents of the first and second circuits; wherein the solder paste disposed above and below the first and second circuits form rivet heads.
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20. An interconnection between circuits, the interconnection comprising:
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a first circuit defining a first surface and a second surface, the first circuit having at least one conductive pad, a relief vent formed through the first circuit conductive pad extending between the first and second surfaces of the first circuit; a spacer defining first and second surfaces, the spacer having at least one aperture alignable to the relief vent of the first circuit; a second circuit defining a first surface and a second surface, the second circuit having at least one conductive pad, a relief vent formed through the second circuit conductive pad extending between the first and second surfaces of the second circuit, the relief vent of the second circuit being alignable to the aperture of the spacer; solder paste disposed within the aperture of the spacer and between the first and second circuits, the solder paste disposed within the relief vents of the first and second circuits; wherein the conductive pads of the first and second circuits are formed on end portions of the first and second circuits, the first and second circuits overlapping in contact with one another only at the end portions of the first and second circuits.
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21. A method of interconnecting first and second circuits, the method comprising the steps of:
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placing a spacer on a first circuit; aligning a relief vent of a second circuit to an aperture of the spacer; disposing solder paste within the aperture of the spacer; stacking the second circuit on the spacer and the first circuit; during the stacking step, displacing the solder paste through the relief vent and out of the relief vent external to the second circuit to form a rivet head. - View Dependent Claims (22, 23)
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Specification