Method of manufacturing surface mount capacitor
First Claim
1. A method of manufacturing a surface mount capacitor comprising a capacitive element having an anode and cathode encapsulated within a case comprising:
- a) supporting the capacitive element on anode and cathode terminations by electrically conductive adhesive between the cathode termination and the capacitive element cathode and electrically insulating material between the anode termination and the capacitive element;
b) placing encapsulating material around the capacitive element and portions of the anode and cathode terminations;
c) shaping the encapsulating material to form a case around the capacitive element and portions of the anode and cathode terminations, leaving exposed a portion of the capacitive element anode at a surface of the case, the case having a top side and a bottom side including at least surface mounting portions of the anode and cathode terminations; and
d) electrically communicating the exposed portion of the capacitive element anode and the anode termination at least in part externally of the case, wherein the electrical communication of the capacitive element anode and the anode termination comprises an external conductive path positioned on the surface of the case.
5 Assignments
0 Petitions
Accused Products
Abstract
A surface mount capacitor (10) and method for making the same. A solid slug or pellet anode body (1) is encapsulated in a case (6) of insulating material. An anode and cathode termination pair (2, 3) are formed with surface mount mounting portions on one side of the case (6). An electrical connection (4) is made from the cathode termination (2) to a cathode on pellet (1) through the case (6). An electrical connection (7) is made between an anode associated with the pellet (1) and the anode termination (3) externally of the case (6). The external connection (7) allows improved volumetric efficiency by freeing up space in the case (6) for a bigger pellet (1). The method includes mass producing these capacitors (10) by mounting a plurality of pellets (1) on a lead frame (11) with pre-formed anode/cathode termination pairs (2, 3), at least substantially encapsulating the plurality of mounted pellets (1) and each pellet'"'"'s associated anode and cathode, singulating the encapsulated pellets (1) to expose a portion of the pellet anode, and applying the electrical external conductive path (7) between pellet anode and anode termination (3).
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Citations
15 Claims
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1. A method of manufacturing a surface mount capacitor comprising a capacitive element having an anode and cathode encapsulated within a case comprising:
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a) supporting the capacitive element on anode and cathode terminations by electrically conductive adhesive between the cathode termination and the capacitive element cathode and electrically insulating material between the anode termination and the capacitive element; b) placing encapsulating material around the capacitive element and portions of the anode and cathode terminations; c) shaping the encapsulating material to form a case around the capacitive element and portions of the anode and cathode terminations, leaving exposed a portion of the capacitive element anode at a surface of the case, the case having a top side and a bottom side including at least surface mounting portions of the anode and cathode terminations; and d) electrically communicating the exposed portion of the capacitive element anode and the anode termination at least in part externally of the case, wherein the electrical communication of the capacitive element anode and the anode termination comprises an external conductive path positioned on the surface of the case. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of mass producing a plurality of surface mount capacitors comprising:
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a) supporting a plurality of capacitive elements on pre-formed anode and cathode terminations on a lead frame by pre-applied electrically conductive adhesive between each cathode termination and each corresponding capacitive element cathode and electrically insulating material between each anode termination and its corresponding capacitive element; b) placing encapsulating material around supported capacitive elements on the lead frame; c) singulating the capacitive elements from each other by removing encapsulating material to form a case at least substantially around each capacitive element and corresponding conductive adhesive, insulative adhesive, and portions of anode and cathode terminations, leaving exposed a portion of the capacitive element anode at a surface of each case, each case having a top side and a bottom side including the anode and cathode terminations; and d) applying an external conductive path adapted to electrically communicate the exposed portion of the capacitive element anode and the anode termination for each capacitive element. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification