Micro-fabricated electrokinetic pump

• US 7,449,122 B2
• Filed: 10/18/2004
• Issued: 11/11/2008
• Est. Priority Date: 09/23/2002
• Status: Expired due to Term

• Current Assignee: Vertiv Corporation (Vertiv Holdings Co.)
• Original Assignee: Cooligy Incorporated (Emerson Electric Company)
• Inventors: Kenny, Thomas, Zeng, Shulin, Santiago, Juan, Goodson, Kenneth, Corbin, David
• Primary Examiner(s): Olsen; Allan
• Application Number:
  US10/968,376
• Publication Number:
  US 20050084385A1
• Time in Patent Office: 1,485 Days
• Field of Search: None
• US Class Current: 216/2
• CPC Class Codes: F04B 17/00 Pumps characterised by combination with, or adaptation to, specific driving engines or motors
• CPC Class Codes: F04B 19/006 Micropumps F04B43/043 and F04B43/095 take precedence

Abstract

An electrokinetic pump for pumping a liquid includes a pumping body having a plurality of narrow, short and straight pore apertures for channeling the liquid through the body. A pair of electrodes for applying a voltage differential are formed on opposing surfaces of the pumping body at opposite ends of the pore apertures. The pumping body is formed on a support structure to maintain a mechanical integrity of the pumping body. The pump can be fabricated using conventional semiconductor processing steps. The pores are preferably formed using plasma etching. The structure is oxidized to insulate the structure and also narrow the pores. A support structure is formed by etching a substrate and removing an interface oxide layer. Electrodes are formed to apply a voltage potential across the pumping body. Another method of fabricating an electrokinetic pump includes providing etch stop alignment marks so that the etch step self-terminates.

Claims

1. A method of fabricating an electrokinetic pump comprising the steps of:

providing a first material having a first surface and a second surface;

coupling a second material to the second surface of the first material;

forming a plurality of support structures in the second material, with a support aperture formed in between each support structure;

forming a plurality of capillaries through the first material, wherein each capillary includes a pore aperture in the first surface and the second surface of the first material;

oxidizing the first surface and the second surface with an insulation agent, wherein an inner surface of each capillary is oxidized with a thin film of the insulation agent; and

coupling a first electrode to the first surface and a second electrode to the second surface,

wherein a plurality of the pore apertures in the second surface of the first material are disposed in between the support structures and are fluidly coupled to the same support aperture, enabling a liquid to flow from the same support aperture into the plurality of the pore apertures in the second surface of the first material disposed in between the support structures, and wherein a voltage potential generated between the first electrode and the second electrode drives the liquid to flow through the plurality of capillaries.

2. The method according to claim 1 wherein the step of coupling a second material to the second surface of the first material comprises the steps of:

applying an oxide agent to the second surface of the first material; and

coupling the second material to the oxide agent.

3. The method according to claim 2, wherein each support structure is coupled to the first material by the oxide agent.

4. The method according to claim 3 further comprising removing a predetermined amount of the oxide agent from the second surface, wherein the removal of the predetermined amount results in exposure of the second surface of the first material that is disposed in between the support structures, while maintaining an amount of oxide agent between the support structures and the second surface to prevent the support structures from separating from the second surface.

5. The method according to claim 4 wherein hydrofluoric acid is applied to the predetermined amount of oxide agent to be removed.

6. The method according to claim 2 further comprising the step of oxidizing each support structure with the insulation agent.

7. The method according to claim 1 wherein the plurality of capillaries are formed by an etching process.

8. The method according to claim 1 wherein a diameter of the pore aperture is in a range of 0.1 and 2 microns.

9. The method according to claim 1 wherein the first material includes a thickness dimension in a range of 10 microns and 1 millimeter.

10. A method of fabricating an electrokinetic pump comprising the steps of:

providing a substrate having a first surface and a second surface;

forming a plurality of alignment marks on the first surface of the substrate, wherein the alignment marks are made of a first material;

applying a second material to the first surface of the substrate, the second material having a first surface and a second surface;

forming a plurality of capillaries through the second material, wherein each capillary includes a pore aperture in the first surface and the second surface of the second material;

forming a support structure at each alignment mark in the substrate, thereby forming a plurality of support structures, wherein a support aperture and an exposed portion of the second surface of the second material is formed between each support structure; and

applying a diffusion oxidizing agent to the first surface and the exposed portion of the second surface of the second material, wherein the diffusion oxidizing agent is applied within the plurality of capillaries,

wherein a plurality of the pore apertures in the exposed portion of the second surface of the second material are disposed in between the support structures and are fluidly coupled to the same support structure, enabling a liquid to flow from the same support structure into the plurality of the pore apertures in the exposed portion of the second surface, and wherein a voltage differential applied between the first and second surface of the second material drives liquid through the plurality of capillaries.

11. The method according to claim 10 further comprising the step of applying the diffusion oxidizing agent to an outer surface of each support structure.

12. The method according to claim 10 further comprising the step of applying an oxide agent to the first surface of the substrate before the second material is applied to the first surface of the substrate.

13. The method according to claim 12 further comprising the step of removing the oxide agent from the second surface of the second material.

14. The method according to claim 10 further comprising the step of coupling means for applying the voltage differential to the first surface and second surface of the second material.

15. The method according to claim 10 wherein the first material is a glass material.

16. The method according to claim 10 wherein the first material is a ceramic material.

17. The method according to claim 10 wherein the second material is a polysilicon material.

18. The method according to claim 10 wherein a diameter of each of the plurality of capillaries is in a range of 0.1 and 2 microns.

19. The method according to claim 10 wherein the second material includes a thickness dimension in a range of 10 microns and 1 millimeter.