Method and structure for fabricating mechanical mirror structures using backside alignment techniques
First Claim
1. A method for fabricating mechanical deflection structures from bonding substrates, the method comprising:
- providing a bonded substrate structure, the bonded substrate structure comprising a first substrate having a first thickness and a first face, the bonded substrate structure comprising a second substrate having a second thickness and a second face, wherein the first face is bonded to the second face, at least the first substrate or at least the second substrate having a buried alignment mark on either the first face or the second face;
applying a layer of photomasking material overlying a backside surface of the first substrate;
illuminating electromagnetic radiation through the layer of photomasking material and through a portion of the first thickness, thereby scattering the electromagnetic radiation off of the buried alignment mark;
detecting an indication of the buried alignment mark using a signal associated with a portion of the electromagnetic radiation, wherein the signal traverses through the portion of the first thickness and through the layer of photomasking material;
aligning a pattern on a reticle to the layer of photomasking to an accuracy of 200 nanometers and less with respect to the buried alignment mark based on the detected indication; and
exposing a portion of the layer of photomasking material once the pattern has been aligned using the buried alignment mark to form a second alignment mark on the backside surface of the first substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for fabricating mechanical structures from bonding substrates. The method includes providing a bonded substrate structure, which includes a first substrate having a first thickness of silicon material and a first face. The bonded substrate also includes a second substrate having a second thickness and a second face. At least the first substrate or at least the second substrate (or both) has an alignment mark comprising a front-size zero mark within a portion of either the first thickness or the second thickness. The method includes applying a layer of photomasking material overlying a first backside surface of the first substrate. The method includes illuminating electromagnetic radiation using a coherent light source through the layer of photoresist material and through a portion of the first thickness. The method includes detecting an indication of the alignment mark using a signal associated with a portion of the electromagnetic radiation from a second backside of the second substrate. The method also includes exposing a portion of the layer of photomasking material once a pattern a portion of a reticle structure has been aligned using the alignment mark.
-
Citations
25 Claims
-
1. A method for fabricating mechanical deflection structures from bonding substrates, the method comprising:
-
providing a bonded substrate structure, the bonded substrate structure comprising a first substrate having a first thickness and a first face, the bonded substrate structure comprising a second substrate having a second thickness and a second face, wherein the first face is bonded to the second face, at least the first substrate or at least the second substrate having a buried alignment mark on either the first face or the second face; applying a layer of photomasking material overlying a backside surface of the first substrate; illuminating electromagnetic radiation through the layer of photomasking material and through a portion of the first thickness, thereby scattering the electromagnetic radiation off of the buried alignment mark; detecting an indication of the buried alignment mark using a signal associated with a portion of the electromagnetic radiation, wherein the signal traverses through the portion of the first thickness and through the layer of photomasking material; aligning a pattern on a reticle to the layer of photomasking to an accuracy of 200 nanometers and less with respect to the buried alignment mark based on the detected indication; and exposing a portion of the layer of photomasking material once the pattern has been aligned using the buried alignment mark to form a second alignment mark on the backside surface of the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A method for fabricating mechanical structures from bonding substrates, the method comprising:
-
providing a bonded substrate structure, the bonded substrate structure comprising a first substrate having a first thickness of silicon material and a first face, the bonded substrate structure comprising a second substrate having a second thickness and a second face, at least the first substrate or at least the second substrate having a buried alignment mark comprising a front-side zero mark on either the first face or the second face; applying a layer of photomasking material overlying a first backside surface of the first substrate; illuminating electromagnetic radiation using a coherent light source through the layer of photomasking material and through a portion of the first thickness; detecting an indication of the buried alignment mark using a signal associated with a portion of the electromagnetic radiation from a second backside of the second substrate; and exposing a portion of the layer of photomasking material once a pattern of a reticle structure has been aligned using the detected indication of the buried alignment mark to form a second alignment mark on the first backside surface of the first substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
-
Specification