Anti-stiction technique for electromechanical systems and electromechanical device employing same
First Claim
1. A method for use in association with an electromechanical device having a substrate and an encapsulation structure, the encapsulation structure being disposed over at least a portion of the substrate and defining at least a portion of a chamber, the electromechanical device further having a mechanical structure disposed in the chamber;
- the method comprising;
forming at least one anti-stiction channel through the encapsulation structure;
introducing an anti-stiction fluid into the chamber via the anti-stiction channel; and
providing a channel cap having at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.
8 Assignments
0 Petitions
Accused Products
Abstract
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.
-
Citations
36 Claims
-
1. A method for use in association with an electromechanical device having a substrate and an encapsulation structure, the encapsulation structure being disposed over at least a portion of the substrate and defining at least a portion of a chamber, the electromechanical device further having a mechanical structure disposed in the chamber;
- the method comprising;
forming at least one anti-stiction channel through the encapsulation structure; introducing an anti-stiction fluid into the chamber via the anti-stiction channel; and providing a channel cap having at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 31, 32, 33, 34, 35, 36)
- the method comprising;
-
26. A method for use in association with an electromechanical device having a substrate and an encapsulation structure, the encapsulation structure being disposed over at least a portion of the substrate and defining at least a portion of a chamber, the electromechanical device further having a mechanical structure disposed in the chamber;
- the method comprising;
forming at least one anti-stiction channel through the encapsulation structure; introducing an anti-stiction fluid into the chamber via the anti-stiction channel; and providing a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part, wherein providing a channel cap comprises fabricating the at least one portion apart from the electromechanical device and thereafter affixing the at least one portion to the electromechanical device. - View Dependent Claims (27, 28, 29)
- the method comprising;
-
30. A method for use in association with an electromechanical device having a substrate and an encapsulation structure, the encapsulation structure being disposed over at least a portion of the substrate and defining at least a portion of a chamber, the electromechanical device further having a mechanical structure disposed in the chamber;
- the method comprising;
forming at least one anti-stiction channel through the encapsulation structure; introducing an anti-stiction fluid into the chamber via the anti-stiction channel; and providing a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part, wherein the at least one portion comprises a wire ball, a stud, or a solder preform.
- the method comprising;
Specification