Microelectromechanical device packages with integral heaters
First Claim
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1. A device package comprising:
- a first ceramic substrate that comprises a concaved surface forming a cavity in the first ceramic substrate;
a second ceramic substrate layer comprising an opening, the second ceramic substrate layer being laminated to the first ceramic substrate with a heater and a bonding material therebetween;
wherein the opening in the second ceramic substrate layer is aligned to the cavity in the first ceramic substrate; and
the heater is disposed around a periphery of the cavity between the first ceramic substrate and the second ceramic substrate layer;
a microelectromechanical device disposed in the cavity;
a light transmissive substrate disposed on a surface of the second ceramic substrate layer and enclosing the microelectromechanical device within the cavity; and
a sealing medium disposed between the second ceramic substrate layer and the light transmissive substrate, wherein the heater is in thermal connection with the sealing medium through the bonding material and the second ceramic substrate layer, such that the heater is capable of melting the sealing medium.
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Abstract
A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.
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Citations
48 Claims
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1. A device package comprising:
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a first ceramic substrate that comprises a concaved surface forming a cavity in the first ceramic substrate; a second ceramic substrate layer comprising an opening, the second ceramic substrate layer being laminated to the first ceramic substrate with a heater and a bonding material therebetween; wherein the opening in the second ceramic substrate layer is aligned to the cavity in the first ceramic substrate; and
the heater is disposed around a periphery of the cavity between the first ceramic substrate and the second ceramic substrate layer;a microelectromechanical device disposed in the cavity; a light transmissive substrate disposed on a surface of the second ceramic substrate layer and enclosing the microelectromechanical device within the cavity; and a sealing medium disposed between the second ceramic substrate layer and the light transmissive substrate, wherein the heater is in thermal connection with the sealing medium through the bonding material and the second ceramic substrate layer, such that the heater is capable of melting the sealing medium. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A device package comprising:
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a planar bottom ceramic substrate having a top surface; a laminate comprising a plurality of ceramic substrate layers bonded together and to the planar bottom ceramic substrate and defining a cavity above the top surface of the planar bottom ceramic substrate; a heater disposed on a top ceramic substrate layer of the plurality of ceramic substrate layers and around a periphery of the cavity; an additional ceramic substrate layer having an opening, the additional ceramic substrate layer being bonded to the top ceramic substrate layer with a bonding material, and covering the heater such that the opening of the additional ceramic substrate layer is aligned to the cavity and the heater is embedded within an area between the additional ceramic substrate layer and the top ceramic substrate layer; a microelectronic device disposed on the top surface of the planar bottom ceramic substrate; a light transmissive substrate disposed on a top surface of the additional ceramic substrate layer and enclosing the microelectronic device within the cavity; and a sealing medium disposed between the additional ceramic substrate layer and the light transmissive substrate, wherein the heater is in thermal connection with the sealing medium through the bonding material and the additional ceramic substrate layer, such that the heater is capable of melting the sealing medium. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A device package comprising:
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a first planar ceramic substrate having a top surface; a second planar ceramic substrate having a bottom surface bonded to the top surface of the first planar ceramic substrate; a heater laminated with a bonding material between the first and second planar ceramic substrates and along a periphery of the first and second planar ceramic substrates; a ceramic substrate layer bonded to a top surface of the second planar ceramic substrate;
the ceramic substrate layer overlying the heater and having an opening defining a cavity above the top surface of the second planar ceramic substrate;a microelectronic device disposed within the cavity on the top surface of the second planar ceramic substrate; a light transmissive substrate disposed on a top surface of the ceramic substrate layer; and a sealing medium disposed between the ceramic substrate layer and the light transmissive substrate, wherein the heater is in thermal connection with the sealing medium through the bonding material and the ceramic substrate layer, such that the heater is capable of melting the sealing medium. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48)
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Specification