Wire bonded wafer level cavity package

• US 7,449,779 B2
• Filed: 12/30/2005
• Issued: 11/11/2008
• Est. Priority Date: 03/22/2005
• Status: Expired due to Fees

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Humpston, Giles, Tuckerman, David B., Honer, Kenneth Allen, Nystrom, Michael J.
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US11/322,617
• Publication Number:
  US 20060220234A1
• Time in Patent Office: 1,047 Days
• Field of Search: 257/704, 257/787, 257/678, 257/730, 257/737, 257/778, 438/108
• US Class Current: 257/737
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

Claims

1. A microelectronic device comprising:

(a) a chip having a front surface and a rear surface, said front surface including an active region and a plurality of contacts exposed at said front surface outside of said active region;

(b) a lid overlaying said front surface of said chip, said lid having an outer surface, an inner surface, and edges bounding said lid, at least one of said edges including one or more outer portions and one or more recesses extending laterally inwardly from said outer portions, said recesses being formed by one or more surfaces oblique to said outer surface of said lid, said contacts being aligned with said recesses and exposed through said recesses.

2. The device as claimed in claim 1 further comprising a seal extending between said lid and said chip around said active region.

3. The device as claimed in claim 2, wherein said seal extends to said outer portions.

4. The device as claimed in claim 1, wherein said chip has a rear surface and edges bounding said front and rear surfaces.

5. The device as claimed in claim 4, wherein said outer portions of said edges of said lid are aligned with one or more edges of said chip.

6. The device as claimed in claim 1, further comprising clips having first portions being disposed in said recesses and engaging said contacts, said clips extending laterally outwardly beyond the lid.

7. The device as claimed in claim 6, wherein said clips include second portions overlying said rear surface of said chip.

8. The device as claimed in claim 1, further comprising conductive features disposed on said lid remote from said chip, said conductive features being electrically connected to said contacts.

9. The device as claimed in claim 8, further comprising wire bonds extending between said conductive features and said contacts, said conductive features being electrically connected to said contacts by said wire bonds.

16. The device as claimed in claim 1, further comprising an electrically conductive material disposed in at least some of said recesses.

17. An assembly comprising a device as claimed in claim 1, and a substrate, said rear surface of said chip facing downwardly toward said substrate, said front surface of said chip and said lid facing upwardly away from said substrate.

18. The assembly as claimed in claim 17, further comprising leads extending from said contacts to said substrate by way of said recesses.

19. The assembly as claimed in claim 18, further comprising conductive pads on said substrate, wherein said leads connect said contacts to said conductive pads.

20. The assembly as claimed in claim 19 further comprising an encapsulant at least partially covering said leads and extending into said recesses.

21. The assembly as claimed in claim 17, wherein said chip includes a rear surface facing downwardly toward said substrate, further comprising clips extending from said contacts to said rear surface of said chip, said chip being electrically connected to said substrate through said clips.

22. The assembly as claimed in claim 21, wherein said substrate has conductive pads exposed thereon, said clips being bonded to said conductive pads.

26. The device of claim 1 wherein each recess has two sloping surfaces defining an angle between about five degrees and about sixty degrees.

27. The device of claim 1 wherein said one or more recesses have dimensions decreasing progressively from said outer surface of said lid to said front surface of said chip.

10. A microelectronic device comprising:

(a) a chip having a front surface and a rear surface, said front surface including an active region and a plurality of contacts exposed at said front surface outside of said active region;

(b) a lid overlaying said front surface of said chip, said lid having an outer surface, an inner surface, and edges bounding said lid, at least one of said edges including one or more outer portions and one or more recesses, said contacts being aligned with said recesses and exposed through said recesses; and

(c) a turret having a main surface and a plurality of appendages extending from said main surface, said appendages extending into at least some of said recesses.

11. The device as claimed in claim 10 wherein at least some of said appendages have electrically conductive features thereon, said conductive features on said appendages being electrically connected to at least some of said contacts.

12. The device as claimed in claim 10, wherein at least some of said appendages define an abutment surface, said abutment surface abutting said front surface of said chip.

13. The device as claimed in claim 10 wherein said turret defines an abutment surface separate from said appendages, said abutment surface abutting said lid.

14. The device as claimed in claim 10 wherein said recesses have walls extending towards and away from said chip and at least one of said appendages abuts a wall of at least one of said recesses.

15. The device as claimed in claim 10 wherein said chip is an imaging chip having an active region on said front surface, and wherein said lid is at least partially transparent, the device further comprising one or more optical elements carried on said turret for focusing an image on said active region.

23. An assembly comprising a device having:

(a) a chip having a front surface and a rear surface, said front surface including an active region and a plurality of contacts exposed at said front surface outside of said active region;

(b) a lid overlaying said front surface of said chip, said lid having an outer surface, an inner surface, and edges bounding said lid, at least one of said edges including one or more outer portions and one or more recesses extending laterally inwardly from said outer portions, said contacts being aligned with said recesses and exposed through said recesses; and

(c) a substrate, said rear surface of said chip facing downwardly toward said substrate, said front surface of said chip and said lid facing upwardly away from said substrate wherein said substrate includes a cavity and a plurality of conductive pads disposed adjacent said cavity, said chip being disposed in said cavity such that said contacts are proximate said conductive pads.

24. The assembly as claimed in claim 23, wherein said chip includes an edge adjacent said contacts, further comprising an electrically-conductive material extending from said contacts across said edge of said chip and onto said conductive pads of said substrate, portions of said electrically-conductive material being disposed in said recesses.

25. An assembly comprising a device having:

(a) a chip having a front surface and a rear surface, said front surface including an active region and a plurality of contacts exposed at said front surface outside of said active region;

(b) a lid overlaying said front surface of said chip, said lid having an outer surface, an inner surface, and edges bounding said lid, at least one of said edges including one or more outer portions and one or more recesses extending laterally inwardly from said outer portions, said contacts being aligned with said recesses and exposed through said recesses; and

(c) a circuit panel, said circuit panel having fingers extending into at least some of said recesses in said lid, said fingers having traces thereon electrically connected to at least some of said contacts.