Methods for producing MEMS with protective coatings using multi-component sacrificial layers
First Claim
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1. A method of manufacturing a microelectromechanical device, the method comprising:
- forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and
selectively removing the sacrificial material, relative to the protective material, from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material.
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Abstract
Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.
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Citations
23 Claims
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1. A method of manufacturing a microelectromechanical device, the method comprising:
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forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and selectively removing the sacrificial material, relative to the protective material, from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of manufacturing a microelectromechanical device, the method comprising:
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forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and selectively removing the sacrificial material, relative to the protective material, from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material, wherein forming the composite layer comprises sputtering a composite target, the composite target comprising the sacrificial material and the protective material.
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22. A method of manufacturing a microelectromechanical device, the method comprising:
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forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and selectively removing the sacrificial material, relative to the protective material, from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material, wherein the protective coating is configured to dissipate an electrical charge between two or more components of the microelectromechanical device. - View Dependent Claims (23)
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Specification