Pre-curved cochlear implant electrode array

• US 7,451,000 B2
• Filed: 11/28/2001
• Issued: 11/11/2008
• Est. Priority Date: 11/29/2000
• Status: Expired due to Fees

• Current Assignee: Cochlear Limited
• Original Assignee: Cochlear Limited
• Inventors: Gibson, Peter, Treaba, Claudiu, Parker, John, Dadd, Fysh
• Primary Examiner(s): Schaetzle; Kennedy J.
• Assistant Examiner(s): SARCIONE, JESSICA LYNN
• Application Number:
  US10/332,515
• Publication Number:
  US 20040030376A1
• Time in Patent Office: 2,540 Days
• Field of Search: 607115-116, 607 55- 57, 607136-137, 607124-126, 298/48, 298/58, 29855-856, 600/377, 600/379, 600/393, 26427211-27216, 264/239, 264/241, 264/263, 264/299
• US Class Current: 607/137
• CPC Class Codes: A61F 11/20 Ear surgery
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: B28B 5/00 Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping

Abstract

An implantable electrode array (30) that can adopt a first configuration selected to allow the array (30) to be inserted into a cochlea (12) of an implantee and at least a second configuration in which the array can apply tissue stimulation. The array (30) comprises an elongate carrier (31) having a proximal end (37), a distal end (34), and an inner surface (35) conformable with the inner wall of the implantee'"'"'s cochlea (12). A plurality of electrodes (36) are supported within the carrier (31) at respective spaced locations thereon in a region between the proximal end (37) and the distal end (34) with at least one of the electrodes having a surface that is at least adjacent the inner surface (35) of the carrier (31). The carrier (31) is formed in the second configuration from a first layer (32) and at least a second layer (32) of resiliently flexible material. A method of forming an array (30) is also described.

Claims

1. A method of manufacturing an implantable electrode array comprising a carrier having a first layer and at least a second layer, the method comprising the steps of:

moulding the first layer of the carrier in a first spiral-shaped mould having a first degree of curvature from a first resiliently flexible material about a series of electrodes such that at least one of the electrodes has a surface that is at least adjacent an inner surface of the first layer;

removing the first layer from the first mould, once the first layer is at least partially cured and placing the first layer in a second spiral-shaped mould having a second degree of curvature different from the first degree of curvature; and

moulding the second layer of the carrier from a second resiliently flexible material over at least a portion of the surface of the spiral-shaped first layer other than its inner surface.

2. A method of manufacturing an implantable electrode array of claim 1 wherein the series of electrodes is formed by positioning a series of platinum rings on or about a removable longitudinal support.

3. A method of manufacturing an implantable electrode array of claim 2 wherein the support comprises a wire coated with a relatively low-friction material.

4. A method of manufacturing an implantable electrode array of claim 3 wherein once the electrodes are positioned on or about the wire, at least one electrically conducting wire is welded to each of the electrodes.

5. A method of manufacturing an implantable electrode array of claim 3 wherein the first spiral-shaped mould subtends an arc of greater than about 720°

.

6. A method of manufacturing an implantable electrode array of claim 3 wherein the second degree of curvature of the second spiral-shaped mould is less than the first degree of curvature, said second mould comprising a spiral-shaped cavity having at least an inner surface and which subtends an arc less than that of the first mould.

7. A method of manufacturing an implantable electrode array of claim 6 wherein the second mould subtends a spiral arc of about 180°

less than the spiral arc subtended by the first mould.

8. A method of manufacturing an implantable electrode array of claim 7 wherein on placement of the first layer in the second mould, the inner-surface of the first layer abuts with the inner surface of the second mould.

9. A method of manufacturing an implantable electrode array of claim 8 wherein once the second layer is at least partially cured, the carrier is removed from the second mould and placed in a straightening jig.

10. A method of manufacturing an implantable electrode array of claim 9 further comprising removing the wire from within the carrier so leaving a lumen within the carrier.

11. A method of manufacturing an implantable electrode array of claim 1 wherein first resiliently flexible material is the same as the second resiliently flexible material.

12. A method of manufacturing an implantable electrode array comprising a carrier having a first layer and at least a second layer, the method comprising the steps of:

moulding the first layer of the carrier in a first spiral-shaped mould having a first degree of curvature from a resiliently flexible material about a series of electrodes such that at least one of the electrodes has a surface that is at least adjacent an inner surface of the first layer; and

in a second spiral-shaped mould, moulding the second layer of the carrier from the resiliently flexible material over at least a portion of the surface of the spiral-shaped first layer other than its inner surface, wherein the second spiral-shaped mould has a second degree of curvature different than the first degree of curvature.

13. A method of manufacturing an implantable electrode array of claim 12 wherein the series of electrodes is formed by positioning a series of platinum rings on or about a removable longitudinal support.

14. A method of manufacturing an implantable electrode array of claim 13 wherein the support comprises a wire coated with a relatively low-friction material.

15. A method of manufacturing an implantable electrode array of claim 14 wherein once the electrodes are positioned on or about the wire, at least one electrically conducting wire is welded to each of the electrodes.

16. A method of manufacturing an implantable electrode array of claim 12 wherein the second degree of curvature is less than the first degree of curvature.