Stackable motherboard and related sensor systems
First Claim
1. A system adapted to receive information from a sensor device, comprising:
- a stackable motherboard including;
a circuit board having a first side and a second side opposite the first side;
a processor mounted on the circuit board;
a first peripheral interconnect coupled to the processor;
a second peripheral interconnect coupled to the processor;
a first motherboard interconnect coupled to the processor, mounted on the first side of the circuit board, and adapted to communicate data between the processor and a first auxiliary motherboard;
a second motherboard interconnect coupled to the processor, mounted on the second side of the circuit board, and adapted to communicate data between the processor and a second auxiliary motherboard; and
a daughterboard adapted to communicate received information between a sensor device and the first peripheral interconnect of the first stackable motherboard.
4 Assignments
0 Petitions
Accused Products
Abstract
The stackable motherboard 10 of the first embodiment includes: a circuit board 19 having a first side 14 and a second side 17 opposite the first side 14, a processor 16 mounted on the circuit board 19, a first peripheral interconnect 18, and a second peripheral interconnect 90. The stackable motherboard 10 also preferably includes: a first motherboard interconnect 99 mounted on the first side 14 of the circuit board 19 and adapted to communicate data between the processor 16 and a first auxiliary motherboard, and a second motherboard interconnect 94 mounted on the second side 17 of the circuit board 19 and adapted to communicate data between the processor 16 and a second auxiliary motherboard.
17 Citations
24 Claims
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1. A system adapted to receive information from a sensor device, comprising:
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a stackable motherboard including; a circuit board having a first side and a second side opposite the first side; a processor mounted on the circuit board; a first peripheral interconnect coupled to the processor;
a second peripheral interconnect coupled to the processor;a first motherboard interconnect coupled to the processor, mounted on the first side of the circuit board, and adapted to communicate data between the processor and a first auxiliary motherboard; a second motherboard interconnect coupled to the processor, mounted on the second side of the circuit board, and adapted to communicate data between the processor and a second auxiliary motherboard; and a daughterboard adapted to communicate received information between a sensor device and the first peripheral interconnect of the first stackable motherboard. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A sensor system, comprising:
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a sensor device adapted to receive information; a first stackable motherboard, including; a circuit board having a first side and a second side opposite the first side; a processor mounted on the circuit board; a first peripheral interconnect coupled to the processor;
a second peripheral interconnect coupled to the processor;a first motherboard interconnect coupled to the processor, mounted on the first side of the circuit board, and adapted to communicate data between the processor and a first auxiliary motherboard; a second motherboard interconnect coupled to the processor, mounted on the second side of the circuit board, and adapted to communicate data between the processor and a second auxiliary motherboard; and a daughterboard adapted to communicate the received information between the sensor device and the first peripheral interconnect of the first stackable motherboard. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method of supplying motherboards and forming at least one sensor system comprising the following steps:
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a) providing a series of stackable motherboards, each including; a circuit board having a first side and a second side opposite the first side;
a processor mounted on the circuit board;a first peripheral interconnect coupled to the processor;
a second peripheral interconnect coupled to the processor;a first motherboard interconnect coupled to the processor, mounted on the first side of the circuit board, and adapted to communicate data between the processor and a first auxiliary motherboard; and a second motherboard interconnect coupled to the processor, mounted on the second side of the circuit board, and adapted to communicate data between the processor and a second auxiliary motherboard; b) providing a series of first sensor devices, each adapted to capture visible images; c) providing a series of first daughterboards, each adapted to communicate the captured visible images between a first sensor device and a first peripheral interconnect of a stackable motherboard; and d) combining one of the first daughterboards, one of the first sensor devices, and one or more of the stackable motherboards to form a first sensor system adapted to capture and process visible images. - View Dependent Claims (17, 18, 19, 20)
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21. A sensor system, comprising:
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a stackable motherboard, including; a circuit board having a first side and a second side opposite the first side; a processor mounted on the circuit board; a first peripheral interconnect coupled to the processor;
a second peripheral interconnect coupled to the processor;a first motherboard interconnect coupled to the processor, mounted on the first side of the circuit board, and adapted to communicate data between the processor and a first auxiliary motherboard; and a second motherboard interconnect coupled to the processor, mounted on the second side of the circuit board, and adapted to communicate data between the processor and a second auxiliary motherboard; and a sensor device adapted to receive information, and communicate the received information to the first peripheral interconnect of the stackable motherboard. - View Dependent Claims (22, 23, 24)
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Specification