Method for fabricating a microscale anemometer
First Claim
Patent Images
1. A method for fabricating a microscale anemometer, the method comprising the steps of:
- forming a sacrificial layer on a substrate;
patterning a metal thin film on the sacrificial layer to form a sensing element;
patterning at least one support for the sensing element, wherein at least a part of the at least one support is provided on the sacrificial layer;
removing the sacrificial layer to release the sensing element and at least the part of the at least one support;
lifting the sensing element away from the substrate to create a clearance between the sensing element and a surface of the substrate; and
patterning a polymer layer substantially overlapping the thin film.
2 Assignments
0 Petitions
Accused Products
Abstract
Method for fabricating a microscale anemometer on a substrate. A sacrificial layer is formed on the substrate, and a metal thin film is patterned to form a sensing element. At least one support for the sensing element is patterned. The sacrificial layer is removed, and the sensing element is lifted away from the substrate by raising the supports, thus creating a clearance between the sensing element and the substrate to allow fluid flow between the sensing element and the substrate. The supports are raised preferably by use of a magnetic field applied to magnetic material patterned on the supports.
-
Citations
13 Claims
-
1. A method for fabricating a microscale anemometer, the method comprising the steps of:
-
forming a sacrificial layer on a substrate; patterning a metal thin film on the sacrificial layer to form a sensing element; patterning at least one support for the sensing element, wherein at least a part of the at least one support is provided on the sacrificial layer; removing the sacrificial layer to release the sensing element and at least the part of the at least one support; lifting the sensing element away from the substrate to create a clearance between the sensing element and a surface of the substrate; and patterning a polymer layer substantially overlapping the thin film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method for fabricating a microscale anemometer, the method comprising the steps of:
-
forming a sacrificial layer on a substrate; patterning a metal thin film on the sacrificial layer to form a sensing element; patterning at least one support for the sensing element, wherein at least a part of the at least one support is provided on the sacrificial layer; removing the sacrificial layer to release the sensing element and at least the part of the at least one support; lifting the sensing element away from the substrate to create a clearance between the sensing element and a surface of the substrate; wherein said step of patterning at least one support includes the step of patterning a beam of ductile metal; further comprising the step of; patterning a layer of magnetic material on the at least one support; wherein the step of lifting the sensing element comprises the step of, after removing the sacrificial layer, applying a magnetic field to the layer of magnetic material to raise the at least one support at an angle with respect to the substrate; wherein said step of patterning the layer of magnetic material comprises the step of, for each of the at least one support, defining a space in the layer of magnetic material to create an uncovered portion which defines a bending region; wherein said step of lifting the sensing element induces plastic deformation in each of the at least one support at its respective bending regions; after the step of removing the sacrificial layer, electroplating the bending region of each of the at least one support with nickel to strengthen the respective bending region; and before said electroplating step, patterning a photoresist on the sensing element.
-
-
10. A method for fabricating a microscale anemometer, the method comprising the steps of:
-
forming a sacrificial layer on a substrate; patterning a metal thin film on the sacrificial layer to form a sensing element; patterning at least one support for the sensing element, wherein at least a part of the at least one support is provided on the sacrificial layer; removing the sacrificial layer to release the sensing element and at least the part of the at least one support; and lifting the sensing element away from the substrate to create a clearance between the sensing element and a surface of the substrate; wherein said step of patterning the support comprises patterning a polymer layer onto the sacrificial layer. - View Dependent Claims (11)
-
-
12. A method for fabricating a microscale anemometer, the method comprising the steps of:
-
forming a sacrificial layer on a substrate; patterning a metal thin film on the sacrificial layer to form a sensing element; patterning at least one support for the sensing element, wherein at least a part of the at least one support is provided on the sacrificial layer; removing the sacrificial layer to release the sensing element and at least the part of the at least one support; and lifting the sensing element away from the substrate to create a clearance between the sensing element and a surface of the substrate, wherein said step of forming a sacrificial layer comprises the steps of; patterning a copper layer onto a surface of the substrate; patterning a chrome layer onto the copper layer; and patterning a titanium thin film onto the chrome layer.
-
-
13. A method for fabricating a microscale anemometer, the method comprising the steps of:
-
forming a sacrificial layer on a substrate; patterning a metal thin film on the sacrificial layer to form a sensing element; patterning at least one support for the sensing element, wherein at least a part of the at least one support is provided on the sacrificial layer; removing the sacrificial layer to release the sensing element and at least the part of the at least one support; lifting the sensing element away from the substrate to create a clearance between the sensing element and a surface of the substrate; patterning a polymer layer substantially overlapping the thin film; and wherein the thin film comprises at least one layer of nickel and at least one layer of platinum.
-
Specification