Modular sensor assembly and methods of fabricating the same

• US 7,451,651 B2
• Filed: 12/11/2006
• Issued: 11/18/2008
• Est. Priority Date: 12/11/2006
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Mills, David Martin, Wodnicki, Robert Gideon, Woychik, Charles Gerard, Fisher, Rayette Ann, Esler, David Richard, Cogan, Scott, Erlbaum, Jeffrey Scott
• Primary Examiner(s): Raevis; Robert R
• Application Number:
  US11/636,822
• Publication Number:
  US 20080134793A1
• Time in Patent Office: 708 Days
• Field of Search: None
• US Class Current: 73/641
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type
• CPC Class Codes: B06B 1/0629 Square array
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01N 2291/106 one or more transducer arrays
• CPC Class Codes: G01N 29/2437 Piezoelectric probes
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05009 Bonding area integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05666 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49007 : Indicating transducer

Abstract

A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.

Claims

1. A sensor assembly comprising:

a sensor array comprising a plurality of sensor modules, wherein each of the plurality of sensor modules comprises a plurality of sensor sub-arrays; and

an electronics array coupled to the sensor array and comprising a plurality of integrated circuit modules, wherein each of the plurality of integrated circuit modules comprises a plurality of integrated circuit chips.

2. The sensor assembly, as set forth in claim 1, wherein the sensor array is coupled to the electronics away via an interconnect.

3. The sensor assembly, as set forth in claim 2, wherein the interconnect comprises one of flip-chip bump bonds, atomic bonds, low temperature fusion bond, laminated gold bumps or indium bumps, copper compression bond, anisotropic conductive films, or combinations thereof.

4. The sensor assembly, as set forth in claim 1, wherein each of the sensor sub-arrays comprises one of a capacitive micromachined ultrasonic transducer (cMUT), a Cadmium Zinc Telluride (CZT) sensor, a piezoelectric transducer (PZT), a piezoelectric micro machined ultrasonic transducer (PMUT), or a photosensor array.

5. The sensor assembly, as set forth in claim 1, wherein each of the plurality of integrated circuit chips comprises an input/output pad region arranged along a single edge of the integrated circuit chip and configured to couple the integrated circuit chip to a sensor system.

6. The sensor assembly, as set forth in claim 1, wherein each of the plurality of integrated circuit chips comprises an input/output pad region arranged along more than one edge of the integrated circuit chip and configured to couple the integrated circuit chip to an ultrasound system.

7. The sensor assembly, as set forth in claim 1, wherein each of the plurality of sensor sub-arrays comprises an input/output pad region arranged along a single edge of the integrated circuit chip and configured to couple the integrated circuit chip to an ultrasound system.

8. The sensor assembly, as set forth in claim 7, wherein each of the plurality of integrated circuit chips comprises an input/output pad region, wherein the input/output pad region is electrically coupled to a substrate via bondwires.

9. The sensor assembly, as set forth in claim 1, wherein the sensor array is coupled to a first side of the electronics array, and wherein the sensor assembly further comprises a substrate coupled to a second side of the electronics array, opposite the first side.

10. The sensor assembly, as set forth in claim 1, wherein the sensor array is coupled to a first side of the electronics array, and wherein the sensor assembly further comprises a second electronics away coupled to a second side of the electronics array, opposite the first side.

11. The sensor assembly, as set forth in claim 10, further comprising a substrate coupled to a second side of the second electronics array, opposite the electronics array, wherein each of the electronics array and the second electronics away are electrically coupled to the substrate via bondwires.

12. The sensor assembly, as set forth in claim 1, wherein one of the sensor away or the electronics away or both includes a redistribution layer (RDL).

13. The sensor assembly, as set forth in claim 1, wherein each of the plurality of sensor sub-array comprises a plurality of sensor elements arranged on a topside of a wafer, and wherein the wafer comprises through-wafer vias configured to electrically couple the plurality of sensor elements to pads arranged on a backside of the wafer.

14. The sensor assembly, as set forth in claim 1, wherein each of the plurality of sensor modules comprises a first number of sensor sub-arrays, and wherein each of the plurality of integrated circuit modules comprises a second number of integrated circuit chips, wherein the first number is equal to the second number.

15. The sensor assembly, as set forth in claim 1, wherein each of the plurality of sensor modules comprises two or more sensor sub-arrays.

16. The sensor assembly, as set forth in claim 1, wherein the sensor array is stacked on top of the electronics array.

17. The sensor assembly, as set forth in claim 1, wherein a ratio of sensor modules to integrated circuit modules is 1:

1.

18. The sensor assembly, as set forth in claim 1, wherein a ratio of sensor sub-arrays to integrated circuit chips is 1:

1.

19. The sensor assembly, as set forth in claim 1, wherein each of the plurality of integrated circuit chips is configured to control a respective one of the plurality of sensor sub-arrays.

20. The sensor assembly, as set forth in claim 1, further comprising an interconnect configured to couple the sensor array to the electronics array, wherein the interconnect comprises a plurality of conductive bumps configured to mechanically couple the sensor away to the electronics array and to transmit electrical signals between the sensor array and the electronics array.

21. The sensor assembly, as set forth in claim 20, wherein the plurality of conductive bumps are surrounded by an underfill material disposed between the sensor away and the electronics array.

22. The sensor assembly, as set forth in claim 21, wherein the underfill material comprises materials configured to acoustically enhance the performance of the sensor array.