Pressure sensor

• US 7,451,653 B1
• Filed: 11/22/2006
• Issued: 11/18/2008
• Est. Priority Date: 11/22/2005
• Status: Expired due to Fees

• Current Assignee: Clayton B. Sippola
• Original Assignee: Clayton B. Sippola
• Inventors: Sippola, Clayton B.
• Primary Examiner(s): THOMPSON, JEWEL VERGIE
• Application Number:
  US11/562,822
• Time in Patent Office: 727 Days
• Field of Search: 737/15, 83/621, 361/283.4
• US Class Current: 73/715
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0052 of piezoresistive elements circuits therefor G01L9/06
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: Y10T 83/089 Responsive to tool characteristic

Abstract

A pressure sensor for measuring an external pressure fabricated upon a ceramic substrate penetrated by a via extending from the top to the bottom of the ceramic substrate is disclosed. A sacrificial layer is deposited on a portion of the top of the ceramic substrate in communication with a via. A diaphragm material is then deposited on the sacrificial layer, thereby creating a diaphragm surface. A sensor element for transducing a mechanical deflection into an electrical signal is applied to the diaphragm surface. When the sacrificial layer is removed, the diaphragm is able to deflect in response to the external pressure, which is sensed by the sensor element in order to measure the external pressure.

Claims

1. A pressure sensor for measuring an external pressure, comprising:

a ceramic substrate with a top surface and a bottom surface and a thickness;

a via with side walls extending through said ceramic substrate from a first aperture on said top surface of said ceramic substrate to a second aperture on said bottom surface of said ceramic substrate;

a sacrificial layer deposited above said top surface of said ceramic substrate and covering said first aperture of said via;

a diaphragm with an upper surface, deposited above said top surface of said ceramic substrate such that said diaphragm covers said sacrificial layer; and

an upper sensor element deposited on said upper surface of said diaphragm;

wherein said via is adapted to accept the introduction of an etchant to release said diaphragm such that upon said release of said diaphragm, said diaphragm deflects in response to the external pressure.

2. A pressure sensor of claim 1, further comprising a sealing layer deposited on said bottom surface of said ceramic substrate, wherein said sealing layer substantially seals said via.

3. A pressure sensor of claim 2, wherein said sealing layer comprises a first coat wherein a via fill is formed within said via by a portion of said first coat and a second coat applied to said first coat whereby said second coat covers said via and said first coat.

4. A pressure sensor of claim 1, wherein said via is comprised of a plurality of said vias, each said via having a surface area of said first aperture of about 7.85×

10−

5 square inches, such that there are about 700 said vias for every one square inch of said sacrificial layer surface area.

5. A pressure sensor of claim 1, wherein said side walls of said via have a spreading angle between about 3 degrees and about 10 degrees.

6. A pressure sensor of claim 1, further comprising:

a bottom sensor element deposited on said top surface of said ceramic substrate such that said bottom sensor element extends to a setback region that surrounds said first aperture;

a lower diaphragm, with an upper surface, deposited on said top surface of said ceramic substrate such that said lower diaphragm fills said setback region; and

,

said sacrificial layer is deposited on said upper surface of said lower diaphragm.

7. A pressure sensor of claim 6, wherein said bottom sensor element comprises an electrode termination portion and an electrode sensing portion such that said electrode sensing portion is substantially covered by said lower diaphragm.

8. A pressure sensor of claim 6, whereby said upper sensor element is electrically separated from said bottom sensor element by said diaphragm.

9. A pressure sensor of claim 6, wherein said setback region extends between about 0.003″

to about 0.012″

from said first aperture of said via.

10. A pressure sensor of claim 1, whereby said sacrificial layer is fabricated from a material selected from the group consisting of:

gold, platinum, palladium, silver, copper, and ruthenium.

11. A pressure sensor of claim 1, wherein said means for releasing said diaphragm is an etchant introduced into said via whereby said etchant substantially dissolves said sacrificial layer.

12. A pressure sensor for measuring an external pressure comprising:

a substrate with a top surface and a bottom surface and a thickness;

a via formed with side walls extending through said ceramic substrate from a first aperture on said top surface of said ceramic substrate to a second aperture on said bottom surface of said ceramic substrate;

a means for depositing a diaphragm on said top surface of said ceramic substrate, wherein said diaphragm substantially surrounds a sacrificial layer, such that said sacrificial layer is only in communication with said via and said diaphragm is held substantially rigid by said sacrificial layer;

a means for releasing said diaphragm thereby enabling a portion of said diaphragm to deflect in response to the external pressure; and

a transducer means for measuring a deflection of a portion of said diaphragm in response to the external pressure which creates a measurable change in electronic properties of said transducer means.

13. A pressure sensor of claim 12, whereby said means for depositing said diaphragm is screen printing a green diaphragm from a screen-print diaphragm paste comprising a dielectric material and screen-print vehicles, evaporating said screen-print vehicles, and firing by heating said diaphragm to at least 750C.

14. A pressure sensor of claim 12, wherein said transducer means comprise a screen-printed bottom electrode beneath said diaphragm and a screen-printed top electrode above said diaphragm, whereby a part of said top electrode is affixed to said portion of said diaphragm that deflects in response to the external pressure.

15. A pressure sensor of claim 14, whereby said deflection of said portion of said diaphragm causes a measurable change in capacitance between said top electrode and said bottom electrode which varies relative to the amount of said deflection.

16. A pressure sensor of claim 14, whereby

said top electrode is a piezoresistive element and said deflection of said portion of said diaphragm causes a resistance of said top electrode to change in response to said deflection;

and

said bottom electrode is a piezoresistive element whereby a resistance of said bottom electrode changes in response to a change in temperature and is substantially unresponsive to the deflection of said portion of said diaphragm.

17. A pressure sensor of claim 12, wherein said transducer means comprises a top electrode fabricated from a screen-printed piezoresistive paste, such that said top electrode is affixed to said portion of said diaphragm that deflects in response to the external pressure.