Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof

• US 7,452,197 B2
• Filed: 01/23/2007
• Issued: 11/18/2008
• Est. Priority Date: 12/26/2002
• Status: Expired due to Fees

• Current Assignee: Hitachi High-Technologies Corporation (Hitachi, Ltd.)
• Original Assignee: Hitachi High-Technologies Corporation (Hitachi, Ltd.)
• Inventors: Wada, Kenya, Hiraseko, Kouji, Onoshiro, Jun
• Primary Examiner(s): Tucker; Philip C
• Assistant Examiner(s): Malekzadeh; Seyed Masoud
• Application Number:
  US11/656,378
• Publication Number:
  US 20070116794A1
• Time in Patent Office: 665 Days
• Field of Search: 425/110, 425/127, 425/129.1, 425/120, 425/375, 425/96, 425/97, 264/263, 264/260
• US Class Current: 425/120
• CPC Class Codes: B05C 5/0208 for applying liquid or other fluent material to separate articles B05C5/0204 takes precedence
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 2202/28 Adhesive materials or arrangements
• CPC Class Codes: H05K 2201/10977 Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

On an application stage of resin are provided two (2) sets of dispensers 20 and 40. The one dispenser 20 supplies the resin directing to an upper side corner on a liquid crystal cell 1, while the other dispenser 40 directing to a lower side corner thereon. The dispenser 40 has a syringe 41 and a needle-like nozzle 42, and the needle-like nozzle 42 emits the resin, directing upward obliquely, onto the lower side corner. Thereby, the resin can be supplied between an edge portion of a lower substrate and a lower surface of a connecting board, but without turning over the panel for display, such as, a liquid crystal cell, etc.

Claims

1. A resin applying apparatus on a panel, for applying resin onto an upper side corner defined between a projection portion of a lower substrate and an upper substrate, and a lower side corner of a drawing portion of the lower substrate from a flexible board, on a panel being made up with two pieces of substrates, in which at least two sides of the lower substrate are projected from the upper substrate and are attached with a plural number of flexible boards at the projection portions of the lower substrate at a predetermined pitch distance therebetween, comprising:

a first and a second dispensers, being disposed on opposite sides of a plane passing between an upper surface of said lower substrate and a lower surface of said upper substrate for applying the resin, at said upper side corner and said lower side corner, under non-contacting condition therewith, wherein

each of those first and second dispensers is constructed with a syringe and a needle-like nozzle, respectively;

the second dispenser for supplying the resin onto said lower side corner is provided with a flow passage for changing the resin supplied from a lower side of said syringe in direction thereof, directing upward obliquely, by means of the needle-like nozzle;

either one of said panel or said dispensers in made to move, relatively, with respect to the other, by means of a transfer means;

said first dispenser for applying the resin onto the upper side corner is so controlled that the resin is applied almost uniformly over a total length of said panel, by means of a first control means; and

said second dispenser for applying the resin onto the lower side corner is so controlled that the resin is applied onto each attaching portion of each of the flexible boards, by means of a second control means.

2. A The resin applying apparatus according to claim 1, wherein said needle-like nozzle of said second dispenser is attached onto a swing arm, and a flow passage between said needle-like nozzle and said syringe of said second dispenser is made of a flexible tube, so that said needle-like nozzle of said second dispenser can be changed in position, between a condition where the emission opening thereof is directed to the lower side corner, and a condition where the emission opening is dipped into a solvent tank, by swinging said swing arm.

3. The resin applying apparatus according to claim 1, wherein the needle-like nozzle of the first dispenser is directed obliquely downward.

4. The resin applying apparatus according to claim 1, wherein each of the first and second dispensers include a suppressing means for sending the resin to said needle-like nozzle with pressure, by applying pressure onto liquid surface within said syringe, and a control means for controlling the emission of the resin from said needle-like nozzle, as well as, stoppage thereof.